公开(公告)号：US20210082782A1

公开(公告)日：2021-03-18

申请号：US16572340

申请日：2019-09-16

Applicant: Advanced Semiconductor Engineering, Inc.

Inventor： Ming-Han WANG ,  Ian HU

IPC: H01L23/31 ,  H01L25/065 ,  H01L23/00 ,  H01L21/56 ,  H01L23/48

Abstract: A semiconductor device package includes a first substrate, a second substrate, and a first electronic component between the first substrate and the second substrate. The first electronic component has a first surface facing the first substrate and a second surface facing the second substrate. The semiconductor device package also includes a first electrical contact disposed on the first surface of the first electronic component and electrically connecting the first surface of the first electronic component with the first substrate. The semiconductor device package also includes a second electrical contact disposed on the second surface of the first electronic component and electrically connecting the second surface of the first electronic component with the second substrate. A method of manufacturing a semiconductor device package is also disclosed.

公开(公告)号：US20220399250A1

公开(公告)日：2022-12-15

申请号：US17344842

申请日：2021-06-10

Applicant: Advanced Semiconductor Engineering, Inc.

Inventor： Yi-Chi CHEN ,  Ming-Han WANG

IPC: H01L23/48 ,  H01L27/146 ,  H01L23/00

Abstract: A semiconductor package includes a first die. The first die includes a semiconductor substrate. The semiconductor substrate has a first surface, a second surface opposite to the first surface, and a through hole between the first surface and the second surface and having an inner wall. The inner wall has a first lever arm. A length of the first lever arm is less than a thickness of the semiconductor substrate.

公开(公告)号：US20220375809A1

公开(公告)日：2022-11-24

申请号：US17883550

申请日：2022-08-08

Applicant: Advanced Semiconductor Engineering, Inc.

Inventor： Ming-Han WANG ,  Ian HU

IPC: H01L23/31 ,  H01L25/065 ,  H01L23/00 ,  H01L21/56 ,  H01L23/48 ,  H01L21/683 ,  H01L25/10

Abstract: A semiconductor device package includes a first substrate, a second substrate, and a first electronic component between the first substrate and the second substrate. The first electronic component has a first surface facing the first substrate and a second surface facing the second substrate. The semiconductor device package also includes a first electrical contact disposed on the first surface of the first electronic component and electrically connecting the first surface of the first electronic component with the first substrate. The semiconductor device package also includes a second electrical contact disposed on the second surface of the first electronic component and electrically connecting the second surface of the first electronic component with the second substrate. A method of manufacturing a semiconductor device package is also disclosed.

公开(公告)号：US20190341368A1

公开(公告)日：2019-11-07

申请号：US15968562

申请日：2018-05-01

Applicant: Advanced Semiconductor Engineering, Inc.

Inventor： Ian HU ,  Ming-Han WANG ,  Tsun-Lung Hsieh ,  Chih-Yi HUANG ,  Chih-Pin HUNG

IPC: H01L25/065 ,  H01L23/498 ,  H01L23/00 ,  H01L23/31 ,  H01L25/00

Abstract: At least some embodiments of the present disclosure relate to a semiconductor device package. The semiconductor device package includes a substrate, an interposer disposed on the substrate, a conductive pillar disposed on the substrate, a first semiconductor device disposed on the interposer and electrically connected to the conductive pillar, a second semiconductor device disposed on the interposer, and an encapsulant surrounding the conductive pillar. The first semiconductor device includes a first conductive pad electrically connected to the interposer. The second semiconductor device includes a second conductive pad electrically connected to the interposer.

公开(公告)号：US20240186201A1

公开(公告)日：2024-06-06

申请号：US18440919

申请日：2024-02-13

Applicant: Advanced Semiconductor Engineering, Inc.

Inventor： Ming-Han WANG ,  Ian HU

IPC: H01L23/31 ,  H01L21/56 ,  H01L21/683 ,  H01L23/00 ,  H01L23/48 ,  H01L25/065 ,  H01L25/10

CPC classification number: H01L23/3128 ,  H01L21/565 ,  H01L21/6835 ,  H01L23/3135 ,  H01L23/481 ,  H01L24/09 ,  H01L24/17 ,  H01L25/0657 ,  H01L25/105 ,  H01L2221/68345 ,  H01L2221/68359 ,  H01L2224/02372 ,  H01L2225/0651 ,  H01L2225/06517 ,  H01L2225/0652 ,  H01L2225/06527 ,  H01L2225/06541 ,  H01L2225/06572 ,  H01L2225/1023 ,  H01L2225/1041 ,  H01L2225/1058 ,  H01L2225/107

Abstract: A semiconductor device package includes a first substrate, a second substrate, and a first electronic component between the first substrate and the second substrate. The first electronic component has a first surface facing the first substrate and a second surface facing the second substrate. The semiconductor device package also includes a first electrical contact disposed on the first surface of the first electronic component and electrically connecting the first surface of the first electronic component with the first substrate. The semiconductor device package also includes a second electrical contact disposed on the second surface of the first electronic component and electrically connecting the second surface of the first electronic component with the second substrate. A method of manufacturing a semiconductor device package is also disclosed.

公开(公告)号：US20220065608A1

公开(公告)日：2022-03-03

申请号：US17008333

申请日：2020-08-31

Applicant: Advanced Semiconductor Engineering, Inc.

Inventor： Hsuan-Yu CHEN ,  Ming-Han WANG

IPC: G01B7/16 ,  G01N1/44

Abstract: An apparatus for deformation measurement and a method for deformation measurement are provided. The apparatus includes a housing, a sample holder, a moving mechanism, a first heating device and a second heating device. The sample holder is in the housing. The moving mechanism is over the sample holder. The first heating device is on the moving mechanism. The second heating device is below the sample holder.

公开(公告)号：US20200275030A1

公开(公告)日：2020-08-27

申请号：US16285000

申请日：2019-02-25

Applicant: Advanced Semiconductor Engineering, Inc.

Inventor： Ming-Han WANG ,  Ian HU ,  Meng-Kai SHIH ,  Hsuan Yu CHEN

IPC: H04N5/232 ,  H04N5/247 ,  H04N5/225 ,  G06T7/00

Abstract: An optical measurement equipment includes an adjustment apparatus and at least two image capturing devices. The image capturing devices have a depth-of-field and attached to the adjustment apparatus. The image capturing devices are adjusted by the adjustment apparatus such that a portion to be measured of a workpiece is located within the depth-of-field of the image capturing devices.

公开(公告)号：US20190080975A1

公开(公告)日：2019-03-14

申请号：US15701394

申请日：2017-09-11

Applicant: Advanced Semiconductor Engineering, Inc.

Inventor： Wei-Hsuan LEE ,  Sung-Mao LI ,  Ming-Han WANG ,  Ian HU

IPC: H01L23/31 ,  H01L21/56 ,  H01L23/00

Abstract: A semiconductor device package includes a semiconductor device, a conductive bump, a first encapsulant and a second encapsulant. The semiconductor device has a first surface, a second surface and a lateral surface. The second surface is opposite to the first surface. The lateral surface extends between the first surface and the second surface. The semiconductor device comprises a conductive pad adjacent to the first surface of the semiconductor device. The conductive bump is electrically connected to the conductive pad. The first encapsulant covers the first surface of the semiconductor device and a first portion of the lateral surface of the semiconductor device, and surrounds the conductive bump. The second encapsulant covers the second surface of the semiconductor device and a second portion of the lateral surface of the semiconductor device.