公开(公告)号：US11869828B2

公开(公告)日：2024-01-09

申请号：US17344842

申请日：2021-06-10

Applicant: Advanced Semiconductor Engineering, Inc.

Inventor： Yi-Chi Chen ,  Ming-Han Wang

IPC: H01L23/48 ,  H01L23/00 ,  H01L27/146 ,  H01L21/768

CPC classification number: H01L23/481 ,  H01L23/562 ,  H01L27/14634

Abstract: A semiconductor package includes a first die. The first die includes a semiconductor substrate. The semiconductor substrate has a first surface, a second surface opposite to the first surface, and a through hole between the first surface and the second surface and having an inner wall. The inner wall has a first lever arm. A length of the first lever arm is less than a thickness of the semiconductor substrate.