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公开(公告)号：US20200312730A1
公开(公告)日：2020-10-01
申请号：US16372107
申请日：2019-04-01
Applicant: Advanced Semiconductor Engineering, Inc.
Inventor： Yu-Ming CHEN , Yu-Sung LIN , Tai-Hung KUO
IPC: H01L23/04 , H01L21/48 , H01L23/544
Abstract: A semiconductor package structure includes a substrate, a semiconductor sensor, a lid and an air-permeable film. The semiconductor sensor is disposed on the substrate. The lid covers the semiconductor sensor and defines a through hole. The air-permeable film covers the through hole of the lid and has a first surface. The first surface is hydrophilic.
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