公开(公告)号：US20210396910A1

公开(公告)日：2021-12-23

申请号：US17292124

申请日：2019-10-14

Applicant: Agency for Science, Technology and Research

Inventor： Shiyang Zhu ,  Chih-Kuo Tseng ,  Ting Hu ,  Zhengji Xu ,  Yuan Dong ,  Alex Yuandong Gu

IPC: G02B1/00 ,  G02B1/02

Abstract: Various embodiments may provide a method of fabricating a meta-lens structure. The method may include forming a first dielectric layer in contact with a silicon wafer. The method may also include forming a second dielectric layer in contact with the first dielectric layer. A refractive index of the second dielectric layer may be different from a refractive index of the first dielectric layer. The method may further include, in patterning the second dielectric layer. The method may additionally include removing at least a portion of the silicon wafer to expose the first dielectric layer.

公开(公告)号：US11960051B2

公开(公告)日：2024-04-16

申请号：US17292124

申请日：2019-10-14

Applicant: Agency for Science, Technology and Research

Inventor： Shiyang Zhu ,  Chih-Kuo Tseng ,  Ting Hu ,  Zhengji Xu ,  Yuan Dong ,  Alex Yuandong Gu

IPC: G02B1/00 ,  G02B1/02

CPC classification number: G02B1/002 ,  G02B1/02

Abstract: Various embodiments may provide a method of fabricating a meta-lens structure. The method may include forming a first dielectric layer in contact with a silicon wafer. The method may also include forming a second dielectric layer in contact with the first dielectric layer. A refractive index of the second dielectric layer may be different from a refractive index of the first dielectric layer. The method may further include, in patterning the second dielectric layer. The method may additionally include removing at least a portion of the silicon wafer to expose the first dielectric layer.