公开(公告)号：US09548531B2

公开(公告)日：2017-01-17

申请号：US14748892

申请日：2015-06-24

Applicant: Airbus Defence and Space GmbH

Inventor： Bernhard Schoenlinner ,  Ulrich Prechtel ,  Thomas Schuster ,  Michael Sabielny ,  Herbert Zippold ,  Kay W. Dittrich ,  Franz Stadler ,  Markus Rothenhaeusler ,  Wilhelm Wulbrand ,  Thomas Koerwien

IPC: H01Q1/42 ,  H01Q15/14 ,  H01Q1/40 ,  H01Q1/28 ,  H01Q1/32 ,  H01Q1/38 ,  H01Q3/08

CPC classification number: H01Q1/42 ,  H01Q1/28 ,  H01Q1/3275 ,  H01Q1/38 ,  H01Q1/40 ,  H01Q1/422 ,  H01Q3/08 ,  H01Q15/141 ,  Y02T50/43

Abstract: A method is provided for manufacturing a radome. The method has the following steps: creation of a contoured fit of at least one section of an inner surface of a wall of the radome; arrangement of a plurality of planar photosensitive semiconductor elements on an outer surface of the contoured fit; placement of the contoured fit with the plurality of planar photosensitive semiconductor elements on the at least one section of the inner surface of the wall; establishing of a connection between the plurality of planar photosensitive semiconductor elements and the wall; and removal of the contoured fit from the radome. This method enables the simple manufacture of a radome with a layer having several semiconductor elements for the electromagnetic shielding of the interior of the radome.

Abstract translation: 提供了制造天线罩的方法。 该方法具有以下步骤：产生天线罩的壁的内表面的至少一个部分的轮廓拟合; 多个平面光敏半导体元件在轮廓配合的外表面上的布置; 将所述轮廓配合与所述多个平面光敏半导体元件放置在所述壁的内表面的所述至少一个部分上; 建立所述多个平面光敏半导体元件与所述壁之间的连接; 并从天线罩中移除轮廓拟合。 该方法能够简单地制造具有用于雷达罩内部的电磁屏蔽的具有若干半导体元件的层的雷达罩。

公开(公告)号：US10573478B2

公开(公告)日：2020-02-25

申请号：US15151798

申请日：2016-05-11

Applicant: Airbus Defence and Space GmbH

Inventor： Bernhard Schoenlinner ,  Ulrich Prechtel

IPC: H01H59/00

Abstract: The present disclosure relates to an electronic high-frequency component for accommodating micro-devices, having at least two housing parts which are joined together by a metal frame and which enclose a cavity, and at least one input signal line configured to introduce electrical high-frequency signals from outside of the component into the cavity. The input signal line is connected to a signal line via. Furthermore, the high-frequency component also has at least one short-circuit via which electrically connects the metal frame to at least one of the housing parts of the component.