公开(公告)号：US12040300B2

公开(公告)日：2024-07-16

申请号：US17853870

申请日：2022-06-29

Applicant: Airoha Technology Corp.

Inventor： Ying-Chih Chen ,  Min-Yu Lin ,  Kuo-Chang Chang ,  Jen-Chan Huang

IPC: H01L23/00 ,  H01L25/065 ,  H01L25/18

CPC classification number: H01L24/29 ,  H01L25/0657 ,  H01L25/18 ,  H01L2224/29076 ,  H01L2224/2908 ,  H01L2224/29082 ,  H01L2224/8385 ,  H01L2225/0651 ,  H01L2225/06524 ,  H01L2225/06562 ,  H01L2924/1421 ,  H01L2924/1438

Abstract: A semiconductor package includes a first die, a second die, and a hybrid-type adhesive. The second die is stacked on the first die through the hybrid-type adhesive. The hybrid-type adhesive includes a conductive adhesive and a non-conductive adhesive. The conductive adhesive is disposed between the non-conductive adhesive and the first die. The non-conductive adhesive is disposed between the conductive adhesive and the second die.

公开(公告)号：US20230136631A1

公开(公告)日：2023-05-04

申请号：US17853870

申请日：2022-06-29

Applicant: Airoha Technology Corp.

Inventor： Ying-Chih Chen ,  Min-Yu Lin ,  Kuo-Chang Chang ,  Jen-Chan Huang

IPC: H01L25/065 ,  H01L25/18 ,  H01L23/00

Abstract: A semiconductor package includes a first die, a second die, and a hybrid-type adhesive. The second die is stacked on the first die through the hybrid-type adhesive. The hybrid-type adhesive includes a conductive adhesive and a non-conductive adhesive. The conductive adhesive is disposed between the non-conductive adhesive and the first die. The non-conductive adhesive is disposed between the conductive adhesive and the second die.