公开(公告)号：US08862417B2

公开(公告)日：2014-10-14

申请号：US13151337

申请日：2011-06-02

申请人： Albert M. Chu ,  Eric D. Johnson ,  William J. Rensch ,  Manikandan Viswanath

发明人： Albert M. Chu ,  Eric D. Johnson ,  William J. Rensch ,  Manikandan Viswanath

IPC分类号： G01N37/00 ,  G06F17/50 ,  H01L21/66

CPC分类号： H01L22/20 ,  H01L22/12 ,  H01L22/14 ,  H01L2924/0002 ,  H01L2924/00

摘要： Systems and methods for determining adjustable wafer acceptance criteria based on chip characteristics. The method includes measuring a density of at least one chip. The method further includes computing a difference in density between the density of the at least one chip and a density of at least one kerf structure. The method further includes calculating an offset value to modify a Wafer Acceptance Criteria (WAC) to match the density difference between the at least one chip and the at least one kerf structure. The method further includes applying the offset value to the WAC for a wafer level measurement in order to increase chip yield performance.

摘要翻译： 基于芯片特性确定可调晶片接收标准的系统和方法。 该方法包括测量至少一个芯片的密度。 该方法还包括计算至少一个芯片的密度与至少一个切口结构的密度之间的密度差。 该方法还包括计算偏移值以修改晶片验收标准（WAC）以匹配至少一个芯片和至少一个切口结构之间的密度差。 该方法还包括将偏移值应用于晶片级测量的WAC以提高芯片产量性能。