公开(公告)号：US20200006258A1

公开(公告)日：2020-01-02

申请号：US16024702

申请日：2018-06-29

申请人： Aleksandar ALEKSOV ,  Thomas SOUNART ,  Kristof DARMAWIKARTA ,  Henning BRAUNISCH ,  Prithwish CHATTERJEE ,  Andrew J. BROWN

发明人： Aleksandar ALEKSOV ,  Thomas SOUNART ,  Kristof DARMAWIKARTA ,  Henning BRAUNISCH ,  Prithwish CHATTERJEE ,  Andrew J. BROWN

IPC分类号： H01L23/64 ,  H01L23/00 ,  H01L23/498 ,  H01L21/48

摘要： Embodiments include an electronic package that includes a dielectric layer and a capacitor on the dielectric layer. In an embodiment, the capacitor comprises a first electrode disposed over the dielectric layer and a capacitor dielectric layer over the first electrode. In an embodiment, the capacitor dielectric layer is an amorphous dielectric layer. In an embodiment, the electronic package may also comprise a second electrode over the capacitor dielectric layer.

公开(公告)号：US20230194786A1

公开(公告)日：2023-06-22

申请号：US17559871

申请日：2021-12-22

申请人： Hiroki TANAKA ,  Brandon C. MARIN ,  Kristof DARMAWIKARTA ,  Srinivas V. PIETAMBARAM

发明人： Hiroki TANAKA ,  Brandon C. MARIN ,  Kristof DARMAWIKARTA ,  Srinivas V. PIETAMBARAM

IPC分类号： G02B6/124 ,  G02B6/34 ,  G02B6/12

CPC分类号： G02B6/124 ,  G02B6/34 ,  G02B6/12004 ,  G02B2006/12142 ,  G02B2006/1204

摘要： Embodiments herein relate to systems, apparatuses, or processes directed to an integrated optical coupler that may be used to optically couple a waveguide and a PIC. In embodiments, the integrated optical coupler may include an optical diffraction grating mechanism, an optical lens, and a Faraday rotator. In embodiments, the integrated optical coupler may at least partially within a housing. Other embodiments may be described and/or claimed.

公开(公告)号：US20220413235A1

公开(公告)日：2022-12-29

申请号：US17358530

申请日：2021-06-25

申请人： Kristof DARMAWIKARTA ,  Xiao Di SUN ZHOU ,  Tarek A. IBRAHIM

发明人： Kristof DARMAWIKARTA ,  Xiao Di SUN ZHOU ,  Tarek A. IBRAHIM

IPC分类号： G02B6/42 ,  H01L25/16 ,  H01L23/00 ,  H01L23/367

摘要： Embodiments described herein may be related to apparatuses, processes, and techniques related to creating deep cavities within a substrate or at an edge of the substrate, by etching a cavity in the substrate to a first copper stop layer, removing the first copper stop layer, and then etching deeper into the cavity to a second copper stop layer. In embodiments this process may be repeated until the desired cavity depth is reached. Other embodiments may be described and/or claimed.