公开(公告)号：US20240264371A1

公开(公告)日：2024-08-08

申请号：US18625342

申请日：2024-04-03

Applicant: Taiwan Semiconductor Manufacturing Company, Ltd.

Inventor： Chih-Tsung Shih ,  Hau-Yan Lu ,  Wei-Kang Liu ,  Yingkit Felix Tsui

IPC: G02B6/12 ,  G02B6/13

CPC classification number: G02B6/12004 ,  G02B6/13 ,  G02B2006/12104 ,  G02B2006/12121 ,  G02B2006/12142

Abstract: Various embodiments of the present disclosure are directed towards a semiconductor package comprising optically coupled integrated circuit (IC) chips. A first IC chip and a second IC chip overlie a substrate at a center of the substrate. A photonic chip overlies the first and second IC chips and is electrically coupled to the second IC chip. A laser device chip overlies the substrate, adjacent to the photonic chip and the second IC chip, at a periphery of the substrate. The photonic chip is configured to modulate a laser beam from the laser device chip in accordance with an electrical signal from the second IC chip and to provide the modulated laser beam to the first IC chip. This facilitates optical communication between the first IC chip to the second IC chip. Various embodiments of the present disclosure are further directed towards simultaneously aligning and bonding constituents of the semiconductor package.

公开(公告)号：US11988906B2

公开(公告)日：2024-05-21

申请号：US17873370

申请日：2022-07-26

Applicant: Taiwan Semiconductor Manufacturing Company, Ltd.

Inventor： Chan-Hong Chern

IPC: G02F1/025 ,  G02B6/12 ,  G02F1/225 ,  G02F1/21

CPC classification number: G02F1/025 ,  G02B6/12 ,  G02F1/225 ,  G02B2006/12097 ,  G02B2006/12142 ,  G02F1/212 ,  G02F2201/063 ,  G02F2203/50

Abstract: An optical phase-shifting device includes a ribbed waveguide portion on an insulating layer, the waveguide portion having a p-n or p-i-n junction extending in a longitudinal direction and having a height. A pair of slab portions are disposed adjacent the waveguide portion, one on each side of the ribbed waveguide portion and on the insulation layer. The slab portion have higher doping concentrations than the respective doping concentrations in the ribbed waveguide portion. At least a portion of each slab portion has a height increasing with distance from the waveguide portion, with the slab height being smaller than that of the waveguide portion at the junction between the waveguide portion and slab portion. A pair of contact portions are formed adjacent the respective slab portion and further away from the waveguide portion. A portion of each contact portion can also have a height varying with distance from the waveguide portion.

公开(公告)号：US20240130677A1

公开(公告)日：2024-04-25

申请号：US18365932

申请日：2023-08-03

Applicant: ROCKLEY PHOTONICS LIMITED

Inventor： Aaron John ZILKIE ,  Hooman ABEDIASL ,  Cristiano DALVI ,  Jeffrey DRISCOLL ,  Alexander GONDARENKO ,  Richard GROTE ,  Haydn Frederick JONES ,  Sean MERRITT ,  Roozbeh PARSA ,  Philip PEREA ,  Andrew George RICKMAN ,  Adam SCOFIELD ,  Guomin YU

IPC: A61B5/00 ,  A61B5/01 ,  A61B5/024 ,  A61B5/145 ,  A61B5/1455 ,  G01J3/44 ,  G02B6/12

CPC classification number: A61B5/6801 ,  A61B5/0075 ,  A61B5/01 ,  A61B5/02427 ,  A61B5/14532 ,  A61B5/14552 ,  A61B5/683 ,  G01J3/4412 ,  G02B6/12004 ,  G02B6/12007 ,  A61B2562/0238 ,  G02B2006/12061 ,  G02B2006/12121 ,  G02B2006/12142

Abstract: An optical sensing module suitable for wearable devices, the optical sensing module comprising: a silicon or silicon nitride transmitter photonic integrated circuit (PIC), the transmitter PIC comprising: a plurality of lasers, each laser of the plurality of lasers operating at a wavelength that is different from the wavelength of the others; an optical manipulation region, the optical manipulation region comprising one or more of: an optical modulator, optical multiplexer (MUX); and additional optical manipulation elements; and one or more optical outputs for light originating from the plurality of lasers.

公开(公告)号：US11914547B2

公开(公告)日：2024-02-27

申请号：US17866973

申请日：2022-07-18

Applicant: Marvell Asia Pte Ltd.

Inventor： Radhakrishnan L. Nagarajan

IPC: G06F15/78 ,  G06F13/42 ,  H04L27/00 ,  G02B6/12 ,  H04L1/00 ,  H04L25/03 ,  G06F13/40 ,  G06F13/364 ,  H04L27/02 ,  H04L5/14 ,  H04L27/18 ,  H04L27/34

CPC classification number: G06F15/7817 ,  G02B6/12004 ,  G06F13/364 ,  G06F13/4072 ,  G06F13/42 ,  G06F13/4282 ,  H04L1/0003 ,  H04L25/03006 ,  H04L27/0008 ,  G02B2006/12061 ,  G02B2006/12097 ,  G02B2006/12121 ,  G02B2006/12123 ,  G02B2006/12142 ,  H04L5/14 ,  H04L25/03343 ,  H04L27/02 ,  H04L27/18 ,  H04L27/34

Abstract: An optical module configured to control a peer to peer transaction includes a silicon photonics substrate, memory formed on the silicon photonics substrate and configured to store a private key, application circuitry formed on the silicon photonics substrate and coupled to the memory, the application circuitry configured to receive, via an external interface, an electrical signal carrying instructions for executing a transaction, verify the transaction using the private key stored in the memory, and selectively generate a transaction message including information for completing the transaction, and optical communication circuitry formed on the silicon photonics substrate and responsive to the application circuitry, the optical communication circuitry configured to generate an optical signal based on the transaction message and transmit the optical signal to at least one remote entity.

公开(公告)号：US11892715B2

公开(公告)日：2024-02-06

申请号：US17552240

申请日：2021-12-15

Applicant: PSIQUANTUM, CORP.

Inventor： Yong Liang ,  Mark G. Thompson ,  Chia-Ming Chang ,  Vimal Kumar Kamineni

IPC: G02F1/035 ,  G02F1/225 ,  G02B6/12

CPC classification number: G02F1/035 ,  G02F1/225 ,  G02B2006/12142

Abstract: An electro-optic device includes a substrate and a waveguide on the substrate. The waveguide includes a layer stack including a plurality of electro-optic material layers interleaved with a plurality of interlayers and a waveguide core adjacent to the layer stack. The waveguide may include a pair of electrodes in electrical contact with the plurality of electro-optic material layers. The plurality of interlayers maintains a first lattice structure at room temperature and a cryogenic temperature. The plurality of electro-optic material layers maintains a second lattice structure and crystallographic phase at the room temperature and the cryogenic temperature.

公开(公告)号：US20230251992A1

公开(公告)日：2023-08-10

申请号：US18135472

申请日：2023-04-17

Applicant: Marvell Asia Pte Ltd

Inventor： Radhakrishnan L. NAGARAJAN ,  Chao XU

IPC: G06F15/78 ,  G06F13/42 ,  G02B6/12 ,  H04L27/00 ,  G06F13/364 ,  G06F13/40 ,  H04L1/00 ,  H04L25/03

CPC classification number: G06F15/7817 ,  G06F13/42 ,  G02B6/12004 ,  H04L27/0008 ,  G06F13/364 ,  G06F13/4072 ,  G06F13/4282 ,  H04L1/0003 ,  H04L25/03006 ,  G02B2006/12061 ,  G02B2006/12097 ,  G02B2006/12121 ,  G02B2006/12123 ,  G02B2006/12142 ,  H04L5/14

Abstract: A hybrid electrical and optic system-on-chip (SOC) device configured for both electrical and optic communication includes a substrate, an electrical device configured for electrical communication arranged on the substrate, a photonics device configured for optic communication arranged on the substrate, and a self-test module arranged on the substrate. The self-test module is configured to receive a loop-back signal indicative of an optical signal output from the photonics device and calibrate the photonics device based on the loop-back signal.

公开(公告)号：US11709384B2

公开(公告)日：2023-07-25

申请号：US17332292

申请日：2021-05-27

Applicant: Fujitsu Optical Components Limited

Inventor： Nobuaki Mitamura

IPC: G02F1/065 ,  G02F1/1337 ,  G02B6/122 ,  G02F1/035 ,  G02B6/12

CPC classification number: G02F1/065 ,  G02B6/122 ,  G02F1/035 ,  G02F1/133711 ,  G02B2006/12085 ,  G02B2006/12142 ,  G02F2202/022

Abstract: A multilayer film includes a single-crystal silicon layer, a first layer containing Zr, a second layer containing ZrO2, and a third layer containing a perovskite oxide having an electrooptic effect. The first layer, the second layer, and the third layer are provided in this order above the single-crystal silicon layer, and the multilayer film is transparent to a wavelength to be used.

公开(公告)号：US11675129B2

公开(公告)日：2023-06-13

申请号：US17874453

申请日：2022-07-27

Applicant: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LIMITED

Inventor： Yi-Chen Chen ,  Lee-Chuan Tseng ,  Shih-Wei Lin

IPC: G02B6/132 ,  G02B6/12

CPC classification number: G02B6/132 ,  G02B2006/12121 ,  G02B2006/12138 ,  G02B2006/12142

Abstract: A semiconductor device is provided. The semiconductor device includes a waveguide over a substrate. The semiconductor device includes a first dielectric structure over the substrate, wherein a portion of the waveguide is in the first dielectric structure. The semiconductor device includes a second dielectric structure under the waveguide, wherein a first sidewall of the second dielectric structure is adjacent a first sidewall of the substrate.

公开(公告)号：US20190219763A1

公开(公告)日：2019-07-18

申请号：US16366713

申请日：2019-03-27

Applicant: MICRON TECHNOLOGY, INC.

Inventor： Sion Quinlan

IPC: G02B6/12 ,  G02B6/293 ,  H04B10/80

CPC classification number: G02B6/12004 ,  G02B6/12002 ,  G02B6/29362 ,  G02B6/2938 ,  G02B2006/12109 ,  G02B2006/12121 ,  G02B2006/12123 ,  G02B2006/12142 ,  H04B10/501 ,  H04B10/516 ,  H04B10/801

Abstract: Apparatuses and methods for photonic communication and photonic addressing are disclosed herein. An example apparatus includes a plurality of photonic sources, a plurality of memory die, a logic die. Each of the plurality of photonic sources provides a photonic signal of a different wavelength and are provided to a first photonic path. Each memory die of the plurality of memory die includes a photonic modulation circuit coupled to the first photonic path, and further includes a photonic detector circuit coupled to a second photonic path. Each memory die of the plurality of memory die is associated with and addressed by a respective wavelength of a photonic signal. The logic die is coupled to the first and second photonic paths, and includes a plurality of photonic circuits. Each of the photonic circuits of the plurality of photonic circuits is associated with a respective wavelength of a photonic signal.

公开(公告)号：US20180314004A1

公开(公告)日：2018-11-01

申请号：US15932800

申请日：2018-04-26

Applicant: University of Central Florida Research Foundation, Inc.

Inventor： Sasan Fathpour ,  Amirmahdi Honardoost ,  Saeed Khan

IPC: G02B6/132 ,  G02B6/122 ,  G02B6/12

CPC classification number: G02B6/132 ,  G02B6/12002 ,  G02B6/12004 ,  G02B6/1228 ,  G02B2006/1204 ,  G02B2006/12061 ,  G02B2006/12097 ,  G02B2006/12142 ,  G02B2006/12188

Abstract: A photonic integrated circuit and a method of fabrication are provided which includes: a substrate; a first optical waveguide disposed, at least in part, extending across the substrate, the first optical waveguide being configured to transmit a first mode of light; and a second optical waveguide located at least partially over the first optical waveguide, the second optical waveguide being configured to transmit a second mode of light, wherein the first optical waveguide is vertically coupled to the second optical waveguide through a third optical waveguide disposed below the second waveguide.