摘要:
A tunable micro-lens and micro-lens array for use in optical communications are disclosed. The micro-lens uses thermo optical material and a temperature controller to adjust the temperature and, hence, the index of refraction of the thermo optical material. In one embodiment, a single temperature controller is used to maintain an array of micro-lenses at a desired temperature. In an alternate embodiment, the individual lenses in an array are separately tunable. The invention may be used with either 2D or 3D lenses, and is well suited for use with existing planar lightwave circuit (PLC) technology.
摘要:
A tunable micro-lens and micro-lens array for use in optical communications are disclosed. The micro-lens uses thermo optical material and a temperature controller to adjust the temperature and, hence, the index of refraction of the thermo optical material. In one embodiment, a single temperature controller is used to maintain an array of micro-lenses at a desired temperature. In an alternate embodiment, the individual lenses in an array are separately tunable. The invention may be used with either 2D or 3D lenses, and is well suited for use with existing planar lightwave circuit (PLC) technology.
摘要:
A tunable micro-lens and micro-lens array for use in optical communications are disclosed. The micro-lens uses thermo optical material and a temperature controller to adjust the temperature and, hence, the index of refraction of the thermo optical material. In one embodiment, a single temperature controller is used to maintain an array of micro-lenses at a desired temperature. In an alternate embodiment, the individual lenses in an array are separately tunable. The invention may be used with either 2D or 3D lenses, and is well suited for use with existing planar lightwave circuit (PLC) technology.
摘要:
Methods and apparatuses for measuring the optical properties of solids, gels, and liquids are disclosed. The apparatuses may be constructed on miniature substrates using conventional semiconductor wafer and packaging processes. The substrates may be mass-produced on wafers, which are then diced to provide individual miniature substrates. High measurement precision, low-manufacturing costs, and other benefits are provided by the present inventions.
摘要:
A tunable micro-lens and micro-lens array for use in optical communications are disclosed. The micro-lens uses thermo optical material and a temperature controller to adjust the temperature and, hence, the index of refraction of the thermo optical material. In one embodiment, a single temperature controller is used to maintain an array of micro-lenses at a desired temperature. In an alternate embodiment, the individual lenses in an array are separately tunable. The invention may be used with either 2D or 3D lenses, and is well suited for use with existing planar lightwave circuit (PLC) technology.
摘要:
Methods and apparatuses for measuring the optical properties of solids, gels, and liquids are disclosed. The apparatuses may be constructed on miniature substrates using conventional semiconductor wafer and packaging processes. The substrates may be mass-produced on wafers, which are then diced to provide individual miniature substrates. High measurement precision, low-manufacturing costs, and other benefits are provided by the present inventions.
摘要:
Optical apparatuses providing optical interconnections among a plurality N of electronic components. One exemplary apparatus comprises a slab waveguide having a core layer that enables light beams to propagate in a plurality of directions, a plurality of N reception ports, and a plurality of N transmission ports, each reception port and each transmission port serving a respective electronic component, and each being optically coupled to the core layer of the slab waveguide. Each transmission port is configured to receive a plurality of light beams from its assigned electronic component and to transmit each received light beam onto the slab waveguide in a direction toward a reception port. Each reception port is configured to receive from the slab waveguide a plurality of light beams transmitted to it from at least two different transmission ports. Light beams within the slab waveguide are permitted to cross paths. Other exemplary embodiments are disclosed.
摘要:
A flexible optical connector suitable for use in an optical backplane for interconnecting optical circuit boards, and methods of making the optical connector, are disclosed. The flexible optical connector comprises a plurality of waveguides on two or more levels providing a plurality of light paths that allow light communication between optical circuit boards. The optical connector can be manufactured separately from the backplane and thereafter mounted on the backplane. The backplane of the present invention may also have a mounting structure for removably retaining and positioning optical circuit board and may, optionally, include electrical traces for providing electrical interconnections between the circuit boards.
摘要:
A flexible optical connector suitable for use in an optical backplane for interconnecting optical circuit boards, and methods of making the optical connector, are disclosed. The flexible optical connector comprises a plurality of waveguides on two or more levels providing a plurality of light paths that allow light communication between optical circuit boards. The optical connector can be manufactured separately from the backplane and thereafter mounted on the backplane. The backplane of the present invention may also have a mounting structure for removably retaining and positioning optical circuit board and may, optionally, include electrical traces for providing electrical interconnections between the circuit boards.
摘要:
A flexible optical connector suitable for use in an optical backplane for interconnecting optical circuit boards, and methods of making the optical connector, are disclosed. The flexible optical connector comprises a plurality of waveguides on two or more levels providing a plurality of light paths that allow light communication between optical circuit boards. The optical connector can be manufactured separately from the backplane and thereafter mounted on the backplane. The backplane of the present invention may also have a mounting structure for removably retaining and positioning optical circuit board and may, optionally, include electrical traces for providing electrical interconnections between the circuit boards.