公开(公告)号：US08523406B2

公开(公告)日：2013-09-03

申请号：US13092544

申请日：2011-04-22

申请人： Allan Hing Chuen Kwong ,  Jun Zhang Zhu

发明人： Allan Hing Chuen Kwong ,  Jun Zhang Zhu

IPC分类号： F21V3/00 ,  F21V5/00

CPC分类号： F21V29/70 ,  F21K9/20 ,  F21V1/00 ,  F21V5/04 ,  F21V7/00 ,  F21V17/06 ,  F21V17/14 ,  F21V17/164 ,  F21V19/045 ,  F21V23/002 ,  F21V29/004 ,  F21V29/85 ,  F21V29/89 ,  F21Y2115/10 ,  H01R13/6658

摘要： An LED light assembly has a heat sink and electrical conductors for electrical communication with a supply of electricity. A ceramic base with an LED chip attaches to the heat sink. Electricity communicating pads in the ceramic base each operatively connect with the LED chip and with the electrical connectors. A plate defines an aperture and overlies the ceramic base for passage of light from the LED chip. The LED light assembly attaches to a housing of a lighting fixture that may include a light shade.

摘要翻译： LED灯组件具有用于与电力供电电气通信的散热器和电导体。 具有LED芯片的陶瓷基座连接到散热器。 陶瓷基座中的电连通焊盘各自与LED芯片和电连接器可操作地连接。 板限定一个孔并覆盖在陶瓷基底上，用于从LED芯片通过光。 LED灯组件连接到可以包括光阴的照明器具的壳体。