公开(公告)号：US20240347984A1

公开(公告)日：2024-10-17

申请号：US18633119

申请日：2024-04-11

申请人： Sound Devices LLC

发明人： Matthew G. Anderson

IPC分类号： H01R13/66 ,  G10H3/18

CPC分类号： H01R13/6658 ,  G10H3/186

摘要： Methods and devices are provided whereby deficiencies in the impedance of a cable connecting an electric guitar and a wireless transmitter or other audio device may be electronically corrected, according to user preferences. User settings may be saved and recalled as needed from a program interface that serially communicates with electronics controlling the behavior of the cable.

公开(公告)号：US20230402793A1

公开(公告)日：2023-12-14

申请号：US17805865

申请日：2022-06-08

申请人： HTC Corporation

发明人： Shih-Nien HUANG

IPC分类号： H01R13/6466 ,  H01R13/66

CPC分类号： H01R13/6466 ,  H01R13/6658

摘要： An electronic device includes a printed circuit board, an integrated circuit, a connector, a choke module and a compensation module. The integrated circuit is disposed on the printed circuit board. The connector is disposed on the printed circuit board. The choke module is disposed on the printed circuit board and coupled between the integrated circuit and the connector. The compensation module is disposed on the printed circuit board and coupled between the choke module and the connector.

公开(公告)号：US20230371178A1

公开(公告)日：2023-11-16

申请号：US18357218

申请日：2023-07-24

申请人： Amphenol Corporation

发明人： Marc B. Cartier, JR. ,  Mark W. Gailus ,  Tom Pitten ,  Donald A. Girard, JR. ,  Huilin Ren

IPC分类号： H05K1/11 ,  H01R13/66 ,  H05K1/14

CPC分类号： H05K1/115 ,  H01R13/6658 ,  H05K1/117 ,  H05K1/145

摘要： A printed circuit board includes a plurality of layers including conductive layers separated by dielectric layers; and at least one via configured for solder attachment to a connector lead of a surface mount connector, the at least one via including a conductive element that extends from an upper surface of the printed circuit board through one or more of the plurality of layers, the conductive element having a recess in a surface thereof. The recess is configured to receive a tip portion of the connector lead of the surface mount connector. The printed circuit board may have via patterns including signal vias and ground vias.

公开(公告)号：US11710916B2

公开(公告)日：2023-07-25

申请号：US17273979

申请日：2021-02-10

申请人： Amphenol Corporation

发明人： Jamison Chen ,  Kelvin Kun Tang ,  Hao Zhou ,  Adrian Green

IPC分类号： H01R12/72 ,  H01R12/55 ,  H01R13/66 ,  H01R24/64 ,  H01R107/00

CPC分类号： H01R12/727 ,  H01R12/55 ,  H01R13/6658 ,  H01R24/64 ,  H01R2107/00

摘要： A surface mount electrical connector and methods of making and using a surface mount electrical connector. The connector includes a housing and a contact subassembly received in the housing. The contact subassembly includes interface contacts, board termination contacts, and an internal circuit board. The interface contacts and the board termination contacts are mounted to the internal circuit board to electrically connect the interface contacts and the board termination contacts through the internal circuit board. Each of surface mount tail ends of the board termination contacts has a bent portion that defines a mounting surface configured to be surface mounted to a mounting face of a main circuit board, to establish an electrical connection between the board termination contacts and the main circuit board.

公开(公告)号：US20190081422A1

公开(公告)日：2019-03-14

申请号：US15884394

申请日：2018-01-31

申请人： Yi-Fang CHUANG ,  Nai-Chien CHANG ,  NICECONN TECHNOLOGY CO., LTD.

发明人： Yi-Fang CHUANG ,  Nai-Chien CHANG

IPC分类号： H01R12/71 ,  H01R12/73 ,  H01R24/60 ,  H05K1/18 ,  H01R13/66

CPC分类号： H01R12/716 ,  H01R4/02 ,  H01R12/732 ,  H01R13/20 ,  H01R13/6273 ,  H01R13/6658 ,  H01R24/60 ,  H01R2107/00 ,  H05K1/18

摘要： A board-to-board connector includes a first circuit board and a second circuit board. The first circuit board has at least one cut. The second circuit board includes a tongue assembly disposed corresponding to the cut, a plurality of connection portions disposed on two opposite surfaces of the tongue assembly, and a plurality of conductive portions electrically connected to the first circuit board. Therefore, the board-to-board connector can effectively reduce the distance between the first circuit board and the second circuit board, which is applicable to the increasingly lightweight and compact electronic devices.

公开(公告)号：US20190020152A1

公开(公告)日：2019-01-17

申请号：US16038114

申请日：2018-07-17

申请人： FOXCONN INTERCONNECT TECHNOLOGY LIMITED

发明人： TERRANCE F. LITTLE

IPC分类号： H01R13/6471 ,  H01R13/66 ,  H01R24/60 ,  H05K1/11 ,  H01R13/502 ,  H01R13/6587

CPC分类号： H01R13/6471 ,  H01R13/502 ,  H01R13/6587 ,  H01R13/6658 ,  H01R24/60 ,  H01R2107/00 ,  H05K1/0245 ,  H05K1/117

摘要： An electrical receptacle connector assembly includes an insulative main housing forming a plurality of mating ports, and a plurality of vertical wafers stacked with one another along a transverse direction in a form that every stacked (differential) signal wafer pair are spaced from the neighboring signal wafer pair by a ground wafer in the transverse direction. The signal wafers and the grounding wafers have corresponding signal contacts and grounding contacts thereon to be exposed upon the corresponding mating ports. A plurality of spring loaded common ground plates extend in the transverse direction so as to reliably mechanically and electrically connect the corresponding grounding wafers at the same time for each common ground plate.

公开(公告)号：US20190020145A1

公开(公告)日：2019-01-17

申请号：US16036002

申请日：2018-07-16

申请人： LOTES CO., LTD

发明人： Ted Ju ,  Chin Chi Lin

IPC分类号： H01R13/506 ,  H05K7/20 ,  H01R13/642

CPC分类号： H01R13/506 ,  H01R13/642 ,  H01R13/6471 ,  H01R13/6582 ,  H01R13/6658 ,  H01R24/60 ,  H05K7/2039

摘要： A connector assembly includes a socket connector and a plug connector. The socket connector includes a main body having a tongue; multiple mating terminals having multiple first contact portions; a shell surrounding the tongue to form an accommodating cavity; and a first thermal conduction member. The first contact portions are exposed from at least one first surface of the tongue and are arranged in a left-right direction. The first thermal conduction member has a first mating portion accommodated in the accommodating cavity, and the first mating portion and the tongue are provided at intervals in the left-right direction. The plug connector includes a circuit board; a chip, provided on the circuit board; a mating joint having an insulating body and multiple conductive terminals provided on the insulating body; and a second thermal conduction member having a second mating portion and a conducting portion thermally conducted with the chip.

公开(公告)号：US20190007259A1

公开(公告)日：2019-01-03

申请号：US16021292

申请日：2018-06-28

申请人： Intel Corporation

发明人： Khang Choong Yong ,  Bok Eng Cheah ,  Jackson Chung Peng Kong ,  Stephen Harvey Hall ,  Yun Rou Lim

IPC分类号： H04L29/10 ,  H01R13/66 ,  H05K1/02

CPC分类号： H04L29/10 ,  H01R13/6658 ,  H01R13/6691 ,  H05K1/025 ,  H05K1/0251 ,  H05K2201/09345 ,  H05K2201/09727

摘要： Apparatus and methods are provided for ameliorating distortion issues associated with a conductor that passes over a void in a reference plane. In an example, the signal conductor can include a first part routed over the major surface of a first side of the reference plane structure on a first side of the void and that approaches a first edge of the reference plane structure with a first trajectory, a second part routed over the major surface of the reference plane structure on a second side of the void and that approaches a second edge of the reference plane structure with a second trajectory, and a third portion connecting the first portion with the second portion, the third portion spanning the void, and having a plurality of spurs extending from a body of the third portion.

公开(公告)号：US20190006802A1

公开(公告)日：2019-01-03

申请号：US16019850

申请日：2018-06-27

申请人： LOTES CO., LTD.

发明人： Ted Ju ,  Chin Chi Lin

IPC分类号： H01R24/78 ,  H01R43/02 ,  H01R13/66 ,  H01R13/516 ,  H05K7/20

CPC分类号： H01R24/78 ,  G06F1/20 ,  H01R13/46 ,  H01R13/516 ,  H01R13/6658 ,  H01R24/60 ,  H01R43/0256 ,  H05K7/20154 ,  H05K7/2039 ,  H05K7/20918

摘要： An assembly includes: a socket connector, having an insulating seat, multiple mating terminals and a metal shell provided outside the insulating seat; at least one first thermal conduction member located outside the metal shell; and a plug connector, including: a circuit board; at least one chip provided on the circuit board; a mating joint electrically connected to one end of the circuit board and having an insulating body, multiple conductive terminals, and a shielding shell provided outside the insulating body; and at least one second thermal conduction member having a conducting portion thermally conductive with the chip and a protruding portion located outside the shielding shell. When the mating joint is mated with the socket connector, the mating terminals are in contact with the conductive terminals to form an electrical connection, and the protruding portion is in contact with the first thermal conduction member to perform thermal conduction.

公开(公告)号：US20180366875A1

公开(公告)日：2018-12-20

申请号：US15780594

申请日：2016-12-05

申请人： Hypertronic Corporation

发明人： Arkady Shinder-Lerner ,  Francesco A. Nania

IPC分类号： H01R13/631 ,  H01R24/60 ,  H01R12/71

CPC分类号： H01R13/631 ,  H01R12/714 ,  H01R12/721 ,  H01R13/24 ,  H01R13/64 ,  H01R13/6658 ,  H01R13/746 ,  H01R13/748 ,  H01R24/60 ,  H01R2107/00

摘要： An electrical connector comprising a first housing defining a cavity therein, a first printed circuit board disposed in the cavity of the first housing, a contact coupled with the first printed circuit board, a disposable second housing defining a cavity therein, and a second printed circuit board disposed in the cavity of the second housing, the second printed circuit board having a contact pad positioned on a surface of the second printed circuit board, the contact pad of the second printed circuit board configured to engage with the contact when the first housing and the second housing are mated together.