公开(公告)号：US11778726B2

公开(公告)日：2023-10-03

申请号：US17680341

申请日：2022-02-25

Applicant: Alpha Networks Inc.

Inventor： Fu-Hung Hsu ,  Hsin-Hong Chen

IPC: H05K1/02

CPC classification number: H05K1/0204

Abstract: A heat dissipation structure and an electronic apparatus having the heat dissipation structure are provided. The electronic apparatus includes a printed circuit board, a high thermal-resisting housing, a thermal pad and a metal bracket. Heat is transferred between the thermal pad and an electronic component mounted on the printed circuit board. The high thermal-resisting housing defines an inner space for accommodating the printed circuit board. A columnar space is formed in the high thermal-resisting housing, and a metal layer is arranged outside the columnar space. The thermal conductivity of the high thermal-resisting housing is not greater than 1 W/m·K. The metal bracket and the printed circuit board are disposed at two opposite sides of the high thermal-resisting housing, respectively. A fastening member penetrates through the metal bracket and is inserted into the columnar space to urge the metal bracket to be in contact with the metal layer.