公开(公告)号：US20240357729A1

公开(公告)日：2024-10-24

申请号：US18683754

申请日：2022-08-16

申请人： Tesla, Inc.

发明人： Mohamed Haitham Helmy Nasr ,  Samuel Lichy ,  Aydin Nabovati ,  Rishabh Bhandari ,  Yong guo Li ,  Zheng Gao

IPC分类号： H05K1/02 ,  H05K1/18

CPC分类号： H05K1/0204 ,  H05K1/181 ,  H05K2201/064 ,  H05K2201/066

摘要： Electronic assemblies with a cold plate having an opening are provided. In one aspect. a system includes an array of electronic components. a control board. and a cold plate having a plurality of openings therethrough. The cold plate can be arranged between the array of electronic components and the control board. The cold plate can cool the array of electronic components. The system can also include a plurality of pass through connectors arranged in the openings in the cold plate and configured to connect the array of electronic components to the control board. The cold plate can also be used to cool the control board electronics and the connectors passing through.

公开(公告)号：US20240347441A1

公开(公告)日：2024-10-17

申请号：US18753858

申请日：2024-06-25

申请人： Texas Instruments Incorporated

发明人： Anindya Poddar ,  Ashok Surendra Prabhu ,  Edgar Dorotyao Balidoy ,  Hau Nguyen ,  Makoto Yoshino ,  MING LI

IPC分类号： H01L23/498 ,  H01L21/48 ,  H01L21/56 ,  H01L23/00 ,  H05K1/02

CPC分类号： H01L23/49861 ,  H01L21/4839 ,  H01L21/565 ,  H01L23/49844 ,  H01L24/48 ,  H05K1/0204 ,  H01L2224/48177 ,  H01L2224/48178 ,  H01L2224/48248 ,  H01L2224/48465 ,  H01L2924/1811 ,  H01L2924/182

摘要： A described example includes: a package substrate having a die pad with a die side surface and having an opposite backside surface, having leads arranged along two opposite sides and having die pad straps extending from two opposing ends of the die pad. The leads lie in a first plane, a portion of the die pad straps lie in a second plane that is spaced from the first plane and located closer to the die pad, and the die pad lies in a third plane that is spaced from and parallel to the second plane in a direction away from the first plane. A semiconductor die is mounted to the die side surface and mold compound covers the semiconductor die, a portion of the leads, and the die side surface of the die pad, and the backside surface of the die pad exposed from the mold compound.

公开(公告)号：US12068219B2

公开(公告)日：2024-08-20

申请号：US17793712

申请日：2021-02-19

申请人： MITSUBISHI MATERIALS CORPORATION

发明人： Toyo Ohashi ,  Yoshiaki Sakaniwa

IPC分类号： H05K1/02 ,  H01L23/373 ,  H05K7/20

CPC分类号： H01L23/3735 ,  H01L23/3736 ,  H05K1/0204 ,  H05K1/0271 ,  H05K7/205 ,  H05K7/20509 ,  H05K2201/068 ,  H05K2201/09136

摘要： A heat sink integrated insulating circuit substrate includes: a heat sink including a top plate part and a cooling fin; an insulating resin layer formed on the top plate part of the heat sink; and a circuit layer made of metal pieces arranged on a surface of the insulating resin layer opposite to the heat sink, wherein, when a maximum length of the top plate part is defined as L, an amount of warpage of the top plate part is defined as Z, and deformation of protruding toward a bonding surface side of the top plate part of the heat sink is defined as a positive amount of warpage, and a curvature of the heat sink is defined as C=|(8×Z)/L2|, a ratio P/Cmax between a maximum curvature Cmax(I/m) of the heat sink during heating from 25° C. to 300° C. and peel strength P (N/cm) of the insulating resin layer satisfies P/Cmax>60.

公开(公告)号：US20240251501A1

公开(公告)日：2024-07-25

申请号：US18577280

申请日：2022-05-23

申请人： Chengdu BOE Optoelectronics Technology Co., Ltd. ,  BOE Technology Group Co., Ltd.

发明人： Jiahua WANG ,  Hao CHENG ,  Jianjun WU ,  Qiang FAN ,  Xin BI ,  Jingchang SU ,  Wen HUANG

IPC分类号： H05K1/02

CPC分类号： H05K1/0259 ,  H05K1/0204 ,  H05K1/028 ,  H05K2201/10128

摘要： A flexible circuit board and a display module are provided. The flexible circuit board includes: a flexible substrate having a chip binding region; a driving chip, arranged in the chip binding region of the flexible substrate; and a protective layer, arranged on a side of the driving chip away from the flexible substrate, where the protective layer includes an electrostatic discharge layer, an orthographic projection of the electrostatic discharge layer on the flexible substrate at least partially overlaps with an orthographic projection of the driving chip on the flexible substrate.

公开(公告)号：US20240244805A1

公开(公告)日：2024-07-18

申请号：US18155464

申请日：2023-01-17

申请人： Toyota Motor Engineering & Manufacturing North America, Inc.

发明人： Feng Zhou ,  Tianzhu Fan

IPC分类号： H05K7/20 ,  H05K1/02 ,  H05K1/18

CPC分类号： H05K7/20927 ,  H05K1/0204 ,  H05K1/185 ,  H05K7/20254 ,  H05K7/20272

摘要： Power electronics device assemblies, circuit board assemblies, and power electronics assemblies are disclosed. In one embodiment, a power electronics device assembly includes an S-cell including a first metal layer comprising a first surface having a recess, a first graphite layer bonded to the first metal layer, a second metal layer bonded to the first graphite layer, a solder layer disposed on the second metal layer, and an electrically insulating layer bonded to the solder layer. The power electronics device assembly may further include a power electronics device disposed within the recess of the first surface of the first metal layer.

公开(公告)号：US12028969B2

公开(公告)日：2024-07-02

申请号：US17687339

申请日：2022-03-04

申请人： Delta Electronics (Shanghai) Co., Ltd.

发明人： Shouyu Hong ,  Haibin Xu ,  Tao Wang ,  Ganyu Zhou ,  Xin Zou ,  Liping Sun ,  Chao Ji ,  Weiqiang Zhang

IPC分类号： H05K1/00 ,  H02M7/00 ,  H02M7/537 ,  H05K1/02 ,  H01L25/11 ,  H01L25/18 ,  H05K1/18 ,  H05K7/20

CPC分类号： H05K1/025 ,  H02M7/003 ,  H02M7/537 ,  H05K1/0204 ,  H05K1/0216 ,  H05K1/0243 ,  H01L25/115 ,  H01L25/18 ,  H05K1/181 ,  H05K7/20509 ,  H05K2201/10015 ,  H05K2201/1003 ,  H05K2201/10166

摘要： A power module and a carrier board are disclosed. The carrier board includes a circuit board body and a prefabricated substrate. The circuit board body includes a wiring layer. The prefabricated substrate is embedded in the circuit board body and includes an insulation layer and a metal layer, the metal layer is disposed on the insulation layer. The insulation layer is formed by a ceramic material. The metal layer is connected to the insulation layer through a sintering process. A surface of the insulation layer, which has contact with the at least one metal layer, has at least a part exposed outside of the at least one metal layer, the part of the insulation layer exposed to the outside of the at least one metal layer is an outer edge portion, and the outer edge portion is extended into the circuit board body along a horizontal direction.

公开(公告)号：US11984773B2

公开(公告)日：2024-05-14

申请号：US17270864

申请日：2019-03-08

申请人： MITSUBA Corporation

发明人： Tomoya Ikariya ,  Takahiko Ogane ,  Fumiaki Koshio ,  Hiroyuki Hirano

IPC分类号： H02K11/33 ,  F04D25/06 ,  F04D25/08 ,  F04D29/58 ,  H01L23/28 ,  H05K1/02 ,  H05K1/05 ,  H05K3/28 ,  H05K7/20 ,  H01L23/467

CPC分类号： H02K11/33 ,  F04D25/06 ,  F04D25/08 ,  F04D29/5813 ,  H01L23/28 ,  H05K1/0204 ,  H05K1/05 ,  H05K3/284 ,  H05K7/2039 ,  H01L23/467 ,  H02K2211/03 ,  H05K2201/066 ,  H05K2201/10159

摘要： A driver for motors according to the present invention is provided with: an aluminum substrate (10) which forms one surface of a housing; an insulating layer (11) which is formed on a surface of the aluminum substrate (10); a plurality of electronic elements (13) which are bonded onto a surface of the insulating layer (11), said surface being on a side opposite to the aluminum substrate (10); and a resin member (14) that covers the surface onto which the electronic elements (13) are bonded. This driver for motors is characterized in that the resin member (14) is obtained by integrating a mold resin part (20) which covers the electronic elements (13) from the upper surface side, a connector (21) which is electrically connected to the electronic elements (13), and a fitting part (22) which is used for fitting to a motor.

公开(公告)号：US20240107672A1

公开(公告)日：2024-03-28

申请号：US18257405

申请日：2021-12-08

申请人： VALEO VISION

发明人： Sebastian KRICK

IPC分类号： H05K1/14 ,  F21S41/153 ,  F21V23/00 ,  H05K1/02 ,  H05K1/18

CPC分类号： H05K1/148 ,  F21S41/153 ,  F21V23/005 ,  H05K1/0204 ,  H05K1/181 ,  H05K2201/042 ,  H05K2201/09972 ,  H05K2201/10106

摘要： A light source support assembly for an automotive vehicle, the light source support assembly includes at least two rigid Printed Circuit Board (PCB) parts having a first rigid PCB part and a second rigid PCB part. The first rigid PCB part is mounted with a plurality of first components that are heat generating components and the second rigid PCB part is mounted with a plurality of second components that are components not generating heat or components generating less heat compared to the plurality of first components. A flexible connecting part interconnecting the first rigid PCB part and the second rigid PCB part, and includes at least one bendable portion configured to bend the light source support assembly.

公开(公告)号：US11910519B2

公开(公告)日：2024-02-20

申请号：US17369676

申请日：2021-07-07

申请人： Eridan Communications, Inc.

发明人： Douglas A. Kirkpatrick ,  Quentin Diduck

IPC分类号： H05K7/20 ,  H05K1/02 ,  H01L23/367 ,  H05K3/30 ,  H05K3/00

CPC分类号： H05K1/0204 ,  H01L23/367 ,  H05K3/0061 ,  H05K3/305 ,  H05K7/205 ,  H05K7/20509 ,  H05K2201/066

摘要： An integrated circuit/printed circuit board (IC-PCB) assembly comprises a PCB and a heatsink plate. The PCB has a first side including a first patterned conductive layer with one or more thermal pads onto which one or more heat slugs of one or more ICs mount, and a second, opposing side including a second patterned conductive layer with a heatsink plate receiving pad onto which the heatsink plate mounts. The heatsink plate has one or more posts that project from a mounting surface of the heatsink plate, and when the heatsink plate is mounted to the heatsink plate receiving pad, each post extends from the second side of the PCB, through a matching hole in the PCB, and to an associated thermal pad located on the first side of the PCB.

公开(公告)号：US20240018019A1

公开(公告)日：2024-01-18

申请号：US18317660

申请日：2023-05-15

申请人： THE UNIVERSITY OF BRITISH COLUMBIA

发明人： Fariborz TAGHIPOUR

IPC分类号： C02F1/32 ,  H05K1/02 ,  H05K1/18 ,  H05K7/20

CPC分类号： C02F1/325 ,  H05K1/0204 ,  H05K1/181 ,  H05K7/20272 ,  C02F2201/3222 ,  C02F2201/3227 ,  C02F2307/10 ,  C02F2201/326 ,  C02F2103/026

摘要： A UV reactor irradiates a flow of fluid with UV radiation. The reactor comprises: a fluid conduit defined by a heat conducting conduit body comprising one or more heat conducting walls for permitting a flow of fluid therethrough; a UV-LED operatively connected to a PCB and oriented for directing radiation into the fluid conduit. The PCB comprises a heat conducting substrate having a first surface. The conduit body is in thermal contact with the first surface of the heat conducting substrate. Heat is dissipated from the UV-LED via the heat conducting substrate, the thermal contact between the first surface of the heat conducting substrate and the heat conducting conduit body, and from the one or more heat conducting walls of the heat conducting conduit body to the fluid flowing through the fluid conduit.