公开(公告)号：US20180242454A1

公开(公告)日：2018-08-23

申请号：US15900031

申请日：2018-02-20

申请人： LG CHEM, LTD.

发明人： Jin Oh Yang ,  Suk Jin Song ,  Young Su Son ,  Jae Young Jang

IPC分类号： H05K1/18 ,  H05K1/11 ,  H05K3/34

CPC分类号： H05K1/18 ,  H05K1/0204 ,  H05K1/111 ,  H05K3/3405 ,  H05K3/3421 ,  H05K3/3447 ,  H05K3/4015 ,  H05K2201/09072 ,  H05K2201/10037 ,  H05K2201/10901

摘要： The present disclosure relates to a printed circuit board connected to a battery, and more particularly, to a printed circuit board having an improved structure connected to an electrode led out from a battery.

公开(公告)号：US20180203490A1

公开(公告)日：2018-07-19

申请号：US15410667

申请日：2017-01-19

申请人： Intel Corporation

发明人： HYOUNG IL KIM

IPC分类号： G06F1/20 ,  H05K1/14 ,  H05K1/02 ,  H05K1/11 ,  H05K1/09 ,  H01L23/40 ,  G06F1/18 ,  H05K3/36 ,  H01R12/73 ,  H01R12/72 ,  H01R12/70

CPC分类号： G06F1/20 ,  G06F1/184 ,  H01L23/4006 ,  H01L2023/4031 ,  H01L2023/405 ,  H01L2023/4087 ,  H01R12/7005 ,  H01R12/7076 ,  H01R12/721 ,  H01R12/73 ,  H05K1/0204 ,  H05K1/092 ,  H05K1/111 ,  H05K1/117 ,  H05K1/144 ,  H05K3/368 ,  H05K2201/041 ,  H05K2201/066 ,  H05K2201/10159 ,  H05K2201/10325 ,  H05K2201/10409

摘要： Microelectronic device assembly including a component attached to substrate by at least a screw. The screw applies compressive force against a pad of a thermally and electrically conductive material having sufficiently low modulus to mitigate stress in addition to providing a thermal and electrical path between the component and the substrate. In some embodiments, the screw affixes a printed circuit board hosting one or more integrated circuit components to a motherboard, or passive heat sink. The pad may be deformed to assuage stress applied through the screw during assembly of the device and/or as the device experiences thermal cycling, for example associated with intermittent operation.

公开(公告)号：US20180160523A1

公开(公告)日：2018-06-07

申请号：US15825856

申请日：2017-11-29

申请人： SAMSUNG ELECTRONICS CO., LTD.

发明人： JUNG-HOON KIM

IPC分类号： H05K1/02 ,  H05K7/20 ,  H05K1/11 ,  H05K1/18 ,  H05K3/46

CPC分类号： H05K1/0204 ,  H05K1/0272 ,  H05K1/117 ,  H05K1/181 ,  H05K3/4644 ,  H05K3/4697 ,  H05K7/20336 ,  H05K2201/064 ,  H05K2201/09063 ,  H05K2201/093 ,  H05K2201/10159 ,  H05K2201/10416 ,  H05K2201/10522

摘要： A printed circuit board includes a substrate base including first and second inner base layers, a plurality of cover base layers, and a screw hole extending from a top to a bottom surface of the substrate base. At least one first cover base layer is disposed on the first inner base layer. At least one second cover base layer is disposed on the second inner base layer. A heat pipe is disposed along an interface between the first and second inner base layers. A ground conductive layer is disposed on at least one of the top surface and the bottom surface of the substrate base at an edge of the screw hole. A first heat dissipating structure is positioned between the top and bottom surfaces of the substrate base. The first heat dissipating structure is connected to the heat pipe and is in direct contact with the ground conductive layer.

公开(公告)号：US09942975B2

公开(公告)日：2018-04-10

申请号：US14875222

申请日：2015-10-05

申请人： Raytheon Company

发明人： James M. Elliott ,  James S. Wilson ,  David E. Swernofsky

IPC分类号： H05K1/02 ,  H05K3/30 ,  H05K1/14

CPC分类号： H05K1/0204 ,  H05K1/0209 ,  H05K1/142 ,  H05K3/301 ,  H05K2201/066 ,  H05K2201/10242

摘要： An apparatus includes a printed circuit board (PCB) including a surface that has a layer of circuitry. The apparatus also includes a heat sink configured to receive heat from the PCB. The apparatus further includes a thermally-conductive post configured to remove the heat from the PCB to the heat sink via thermal conduction through a thermal path. The thermal path is substantially orthogonal to the surface of the PCB. The post includes an end configured to physically couple to the layer of circuitry.

公开(公告)号：US09924590B2

公开(公告)日：2018-03-20

申请号：US15159393

申请日：2016-05-19

申请人： Tomoyoshi Kobayashi ,  Masato Kasashima

发明人： Tomoyoshi Kobayashi ,  Masato Kasashima

IPC分类号： H05K1/02 ,  H05K1/05 ,  H05K1/11 ,  H05K1/18 ,  H05K3/00 ,  H05K3/46

CPC分类号： H05K1/0204 ,  H05K1/0271 ,  H05K3/0061 ,  H05K3/4623 ,  H05K3/4697 ,  H05K2201/0129 ,  H05K2201/0187 ,  H05K2201/09036 ,  H05K2201/09145 ,  H05K2201/09227 ,  H05K2201/09854 ,  H05K2201/10166 ,  H05K2201/10416 ,  H05K2203/063

摘要： A printed board includes: a base member; a recess portion provided in the base member; a heat dissipation member fitted into the recess portion; and a wiring pattern provided on an upper side of the base member and the heat dissipation member via an insulator. A contact portion in which an inner circumferential surface of the recess portion and an outer circumferential surface of the heat dissipation member contact each other and a separation portion in which those do contact each other are formed. A gap between the recess portion and the heat dissipation member is filled with thermosetting resin of the base member melted by heating. At least a partial portion in a width direction of the wiring pattern passes through a position vertically overlapping the separation portion while an entire portion thereof does not pass through a position vertically overlapping the contact portion.

公开(公告)号：US09924589B2

公开(公告)日：2018-03-20

申请号：US14980395

申请日：2015-12-28

申请人： Masato Kasashima ,  Tomoyoshi Kobayashi ,  Satoru Sasaki ,  Yoshihiro Ikushima

发明人： Masato Kasashima ,  Tomoyoshi Kobayashi ,  Satoru Sasaki ,  Yoshihiro Ikushima

IPC分类号： H05K1/02 ,  H05K1/11 ,  H05K3/00 ,  H05K3/46

CPC分类号： H05K1/0204 ,  H05K3/0061 ,  H05K3/4697 ,  H05K2201/10409 ,  H05K2201/10416

摘要： A circuit board includes a first insulating layer having an upper surface on which mounting regions of electronic components and wiring patterns are provided, a metal core provided on the lower surface of the first insulating layer, in such a way as to vertically overlap with the mounting regions, and a second insulating layer provided on the lower surface of the first insulating layer, around the metal core. The lower surface of the metal core is exposed from the second insulating layer, the thermal conductivities of the first insulating layer and the metal core are higher than the thermal conductivity of the second insulating layer, and the hardness of the first insulating layer is higher than the hardness of the second insulating layer. Through holes that penetrate the insulating layers and that connect wiring patterns of the insulating layers are provided.

公开(公告)号：US09900973B2

公开(公告)日：2018-02-20

申请号：US14867465

申请日：2015-09-28

申请人： NEC Corporation

发明人： Yuki Matsumoto

IPC分类号： H05K7/20 ,  H01L23/40 ,  H01L23/36 ,  H05K1/02

CPC分类号： H05K1/0204 ,  H01L23/36 ,  H01L23/40 ,  H05K7/2039 ,  H05K2201/066 ,  H05K2201/10409

摘要： The object of the present invention is to provide a cooling device capable of more efficiently cooling heating components heated. The cooling device has a first heat sink and a heat conductor. The first heat sink is thermally coupled to a first heating component mounted on a first surface of a circuit board. The heat conductor is thermally coupled to a second heating component mounted on a second surface of the circuit board and is thermally coupled to the first heat sink.

公开(公告)号：US20180049316A1

公开(公告)日：2018-02-15

申请号：US15557142

申请日：2016-03-15

申请人： AutoNetworks Technologies, Ltd. ,  Sumitomo Wiring Systems, Ltd. ,  SUMITOMO ELECTRIC INDUSTRIES, LTD.

发明人： Yu MURONOI ,  Tou CHIN

IPC分类号： H05K1/02 ,  H05K3/34 ,  H05K1/18

CPC分类号： H05K1/0271 ,  H05K1/0204 ,  H05K1/0265 ,  H05K1/181 ,  H05K3/341 ,  H05K2201/068 ,  H05K2201/10227 ,  H05K2201/10272 ,  H05K2201/10416 ,  Y02P70/611

摘要： A circuit structure that has a high rigidity, has high cooling performance for an electronic component, and can reduce electrical resistance between the electronic component and a bus bar. The circuit structure has a circuit board, bus bars, a binding material, metal chips, and electronic components. The circuit board has opening portions that penetrate in the thickness direction. The bus bars are overlaid on the circuit board. The binding material is interposed between the circuit board and the bus bars and binds them. The metal chips are arranged inside the opening portions and also placed on the bus bars. The metal chips each have a top face, which is located in approximately the same plane as an opening end face of an opening portion, and a bottom face, approximately the entire surface of which is joined to a bus bar. The electronic components are soldered to the circuit board and the top faces of the metal chips.

公开(公告)号：US20180048255A1

公开(公告)日：2018-02-15

申请号：US15790561

申请日：2017-10-23

申请人： LCDRIVES CORP.

发明人： Russel Hugh Marvin ,  David H. Leach

IPC分类号： H02P27/06 ,  H05K1/02 ,  H02M7/00 ,  H05K1/18 ,  H03K17/16 ,  H02P29/02

CPC分类号： H02P27/06 ,  H02M7/003 ,  H02M2007/4835 ,  H02P27/14 ,  H02P29/02 ,  H03K17/161 ,  H05K1/0204 ,  H05K1/181 ,  H05K2201/10015 ,  H05K2201/10166 ,  H05K2201/10522 ,  H05K2201/10545

摘要： One example includes a half-bridge switching circuit system. The system includes a first plurality of switches arranged between a first rail voltage and an output on which an output voltage is provided and a second plurality of switches arranged between a second rail voltage and the output, the first and second pluralities of switches being controlled via a plurality of switching signals. The system also includes a plurality of flying capacitors arranged to interconnect the first and second pluralities of switches, and further includes a plurality of snubber circuits that are each arranged in parallel with a respective one of the plurality of flying capacitors, the first plurality of switches, and the second plurality of switches.

公开(公告)号：US20180025956A1

公开(公告)日：2018-01-25

申请号：US15723206

申请日：2017-10-03

申请人： Subtron Technology Co., Ltd.

发明人： Chih-Hsien Cheng

IPC分类号： H01L23/13 ,  H05K1/02 ,  H05K3/42

CPC分类号： H01L23/13 ,  H01L23/3677 ,  H01L23/49822 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73265 ,  H05K1/0204 ,  H05K3/022 ,  H05K3/427 ,  H05K2201/10416 ,  H05K2203/0191 ,  H01L2924/00014

摘要： A manufacturing method of a package carrier is provided. A substrate having a through hole is provided, wherein a profile of the through hole from top view is a first rounded rectangular. A heat conducting slug is disposed inside the through hole, wherein the heat conducting slug and an inner wall of the through hole are separated with a gap, and a profile of the heat conducting slug from top view is a second rounded rectangular. An insulating material is filled in the through hole so as to fix the heat conducting slug in the through hole. A conductive through hole structure, a first and a second patterned circuit layers are formed. The first and the second patterned circuit layers are respectively formed on two opposite sides of the substrate. The conductive through hole structure penetrates the substrate and connects portions of the first and the second patterned circuit layers.