公开(公告)号：US11615370B1

公开(公告)日：2023-03-28

申请号：US16435177

申请日：2019-06-07

Applicant: Amazon Technologies, Inc.

Inventor： Jin Li ,  Xingang Guo ,  Shao-Wen Yang ,  Kaushik Mani ,  Taru Roy ,  Ahmet Can Musabeyoglu ,  Gerald J. Nievera

IPC: G06Q10/08 ,  B60R25/24 ,  G01C21/34 ,  G06Q30/06 ,  G06Q50/30 ,  G07C5/00 ,  G06Q10/0835 ,  G06Q30/0601

Abstract: With respect to a package delivery system configured to optimize efficiencies associated with package delivery, a server computing device may monitor locations and conditions associated with a fleet of vehicles. A vehicle including a first delivery person may be dispatched with packages for delivery. The server computing device may provide updated delivery routes based on traffic and/or other conditions in the environment. At the completion of a work shift associated with the first delivery person, the vehicle may be parked at a location proximate the delivery route. The server computing device may dispatch a second delivery person to the location. Based on an indication that the second delivery person is proximate the vehicle, the server computing device may cause a user interface to surface on a computing device of the second delivery person, enabling the second delivery person to unlock the vehicle and continue delivering the packages.

公开(公告)号：US12265869B1

公开(公告)日：2025-04-01

申请号：US18374965

申请日：2023-09-29

Applicant: Amazon Technologies, Inc.

Inventor： Anubhav Khanna ,  Kaushik Mani ,  Gerald J. Nievera ,  Andrew Bradley Palmer ,  Sai Praveen Gummadi ,  Robi Thomas ,  Cameron Sautner ,  Rishabh Sanghvi ,  Pavel Samarkin ,  Ram Nikhil Dodda

IPC: G06K19/073 ,  H01Q1/36

Abstract: The present disclosure presents wall-mounted near field communication systems and related methods. One such system comprises a sign assembly having a near field communication (NFC) tag comprising a first conducting member, a substrate assembly having a weakness area, wherein the substrate assembly comprises a plastic substrate; and first adhesive securing the NFC tag device to the substrate assembly such that the first conducting member is disposed proximate the weakness area.