公开(公告)号：US11449114B2

公开(公告)日：2022-09-20

申请号：US16829548

申请日：2020-03-25

Applicant: Amazon Technologies, Inc.

Inventor： Allen David Minnehan ,  Miguel A. Morales ,  Nathan M. Li ,  Albert John Yu Sam Chua ,  Matthew F. Ardema

IPC: G06F1/20 ,  F21V33/00 ,  G06F3/16 ,  H04R1/02 ,  H04R9/06 ,  F21Y115/10 ,  H05K1/18

Abstract: Systems, methods, and computer-readable media are disclosed for voice activated devices with integrated heatsinks and speakers. In one embodiment, an example voice activated device may include a housing having an upper portion and a lower portion, a speaker housing coupled to the lower portion, where the speaker housing and the lower portion together form a sealed chamber, a heatsink coupled to the lower portion and disposed in the sealed chamber, and a first speaker coupled to the speaker housing and partially disposed within the sealed chamber, where the first speaker is oriented to output audio towards the upper portion of the housing.

公开(公告)号：US20210303041A1

公开(公告)日：2021-09-30

申请号：US16829548

申请日：2020-03-25

Applicant: Amazon Technologies, Inc.

Inventor： Allen David Minnehan ,  Miguel A. Morales ,  Nathan M. Li ,  Albert John Yu Sam Chua ,  Matthew F. Ardema

IPC: G06F1/20 ,  G06F3/16 ,  H04R1/02 ,  H04R9/06 ,  F21V33/00

Abstract: Systems, methods, and computer-readable media are disclosed for voice activated devices with integrated heatsinks and speakers. In one embodiment, an example voice activated device may include a housing having an upper portion and a lower portion, a speaker housing coupled to the lower portion, where the speaker housing and the lower portion together form a sealed chamber, a heatsink coupled to the lower portion and disposed in the sealed chamber, and a first speaker coupled to the speaker housing and partially disposed within the sealed chamber, where the first speaker is oriented to output audio towards the upper portion of the housing.