公开(公告)号：US10264714B1

公开(公告)日：2019-04-16

申请号：US15277918

申请日：2016-09-27

Applicant: Amazon Technologies, Inc.

Inventor： Nicole Dolan ,  Stephanie Towner ,  Brian Herman

IPC: F24F1/04 ,  G06F1/20 ,  H05K7/20 ,  G05D1/00 ,  G05B15/02

Abstract: A facility containing electronic components can be cooled by one or more automated cooling units. One or more automated cooling units are automatically deployed to respond to temperature events at one or more electronic components by moving the automated cooling unit to the electronic component and operating a cooling assembly to pass air through an affected component, or by moving the automated cooling unit to a designated air handler or air source and supplementing a flow of air generated by the air handler. Multiple automated cooling units can be employed at the same time.