公开(公告)号：US20230207710A1

公开(公告)日：2023-06-29

申请号：US18065323

申请日：2022-12-13

Applicant: Analog Devices, Inc.

Inventor： Noe QUINTERO ,  Brian Hamilton

IPC: H01L31/02 ,  H01L31/107 ,  H01L25/16 ,  G01S7/4863

CPC classification number: H01L31/02005 ,  H01L31/107 ,  H01L25/167 ,  G01S7/4863

Abstract: Techniques, methods, and systems are provided for packaging high-voltage packages. On example system package includes circuitries comprising circuit elements; and a plurality of connection pins including low-voltage pins; input/output (IO) pins arranged in regions proximate edges of the system package; and high-voltage pins arranged in an inner region of the system package away from all edges of the system package.