公开(公告)号：US20210239539A1

公开(公告)日：2021-08-05

申请号：US17026094

申请日：2020-09-18

Applicant: Analog Devices, Inc.

Inventor： Charles D. Smitherman ,  Michael J. Flaherty ,  Eugene Oh Hwang

IPC: G01K1/18 ,  G01K1/02 ,  G01K1/08

Abstract: Packages for wireless temperature sensor nodes are described. These wireless temperature sensor nodes are suitable for sensing the temperature of remote objects, such as objects that are difficult to access. These packages are designed to enhance the sensor's ability to sense temperature. For example, these packages may be designed to provide a low thermal resistance path between the object and the temperature sensor, a high thermal resistance between an antenna of the wireless temperature sensor node and the object, and at least in some embodiments, immunity to vibrations. One such package includes means for providing a thermal conductive path from the temperature sensor to a thermally conductive support in contact with the object (for example with a thermal resistance less than 10 K/W), and means for thermally conductively decoupling the circuit board from the thermally conductive support (for example by at least 100 K/W).

公开(公告)号：US11940331B2

公开(公告)日：2024-03-26

申请号：US17026094

申请日：2020-09-18

Applicant: Analog Devices, Inc.

Inventor： Charles D. Smitherman ,  Michael J. Flaherty ,  Eugene Oh Hwang

IPC: G01K1/18 ,  G01K1/024 ,  G01K1/08

CPC classification number: G01K1/18 ,  G01K1/024 ,  G01K1/08

Abstract: Packages for wireless temperature sensor nodes are described. These wireless temperature sensor nodes are suitable for sensing the temperature of remote objects, such as objects that are difficult to access. These packages are designed to enhance the sensor's ability to sense temperature. For example, these packages may be designed to provide a low thermal resistance path between the object and the temperature sensor, a high thermal resistance between an antenna of the wireless temperature sensor node and the object, and at least in some embodiments, immunity to vibrations. One such package includes means for providing a thermal conductive path from the temperature sensor to a thermally conductive support in contact with the object (for example with a thermal resistance less than 10 K/W), and means for thermally conductively decoupling the circuit board from the thermally conductive support (for example by at least 100 K/W).