公开(公告)号：US20230170313A1

公开(公告)日：2023-06-01

申请号：US18059916

申请日：2022-11-29

Applicant: Analog Devices, Inc.

Inventor： Clement Joseph Wagner ,  Micah Galletta O'Halloran

IPC: H01L23/00 ,  H01L23/498 ,  H01L21/48 ,  H01L21/56

CPC classification number: H01L23/562 ,  H01L23/49822 ,  H01L21/4857 ,  H01L21/563 ,  H01L2224/16225 ,  H01L24/16

Abstract: A laminate substrate panel may include an upper layer at or near a top surface of the panel. The laminate substrate panel may include a lower layer at or near a bottom surface of the panel. The laminate substrate panel may also include an array of functional laminate cells, each functional laminate cell of the array having a first upper pattern in the upper layer and a first lower pattern in the lower layer. The laminate substrate panel may also include a dummy laminate cell adjacent the array of functional laminate cells, the dummy laminate cell having a second upper pattern in the upper layer and a second lower pattern in the lower layer, the second upper and lower patterns configured to compensate for at least one of an opposing layer area density mismatch and a material density in at least one of the first upper and lower patterns.