公开(公告)号：US20160229689A1

公开(公告)日：2016-08-11

申请号：US15004252

申请日：2016-01-22

Applicant: Analog Devices, Inc.

Inventor： Bradley C. Kaanta ,  John A. Alberghini ,  Kemiao Jia

IPC: B81B7/00 ,  B81C1/00

CPC classification number: B81B7/0048

Abstract: A packaged microchip has a base, a die with a mounting surface, and an electrically inactive interposer between the base and the die. The interposer has a first side with at least one recess that extends no more than part-way through the interposer from the first side. Accordingly, the recess defines a top portion (of the first side) with a top area. The die mounting surface, which is coupled with the interposer, correspondingly has a die area. The top area of the interposer preferably is less than the die area.

Abstract translation: 封装的微芯片具有基座，具有安装表面的管芯，以及在基座和管芯之间的无电插拔器。 插入器具有第一侧面，该第一侧面具有至少一个凹槽，该凹槽不超过第一侧的插入件的一部分延伸。 因此，凹部限定具有顶部区域的顶部（第一侧的顶部）。 与插入器耦合的管芯安装表面相应地具有管芯区域。 插入件的顶部面积优选小于模具面积。