公开(公告)号：US20190212190A1

公开(公告)日：2019-07-11

申请号：US15868899

申请日：2018-01-11

Applicant: Analog Devices Global Unlimited Company

Inventor： David Frank Bolognia ,  Camille Louis Huin ,  Brian Hall

IPC: G01J1/02 ,  G01J1/42

Abstract: An optical device package is disclosed. The optical device package includes a substrate that passes light at an optical wavelength. The optical device package also includes an optical device assembly that is mounted to the substrate. The optical device assembly comprises an optical device die. The optical device die has a first surface that is mounted to and facing the substrate and a second surface that is opposite the first surface. The optical device package further includes a molding compound that is disposed at least partially over the second surface of the integrated device die.

公开(公告)号：US10712197B2

公开(公告)日：2020-07-14

申请号：US15868899

申请日：2018-01-11

Applicant: Analog Devices Global Unlimited Company

Inventor： David Frank Bolognia ,  Camille Louis Huin ,  Brian Hall

IPC: G01J1/02 ,  G01J1/42 ,  A61B5/024 ,  G01J1/04

Abstract: An optical device package is disclosed. The optical device package includes a substrate that passes light at an optical wavelength. The optical device package also includes an optical device assembly that is mounted to the substrate. The optical device assembly comprises an optical device die. The optical device die has a first surface that is mounted to and facing the substrate and a second surface that is opposite the first surface. The optical device package further includes a molding compound that is disposed at least partially over the second surface of the integrated device die.