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公开(公告)号：US11450469B2
公开(公告)日：2022-09-20
申请号：US16553954
申请日：2019-08-28
发明人： Paul Lambkin , Patrick J. Murphy , Bernard Patrick Stenson , Laurence B. O'Sullivan , Stephen O'Brien , Shane Geary , Baoxing Chen , Sombel Diaham
摘要： A micro-isolator is described. The micro-isolator may include a first isolator element, a second isolator element, and a first dielectric material separating the first isolator element from the second isolator element. A second dielectric material may completely or partly encapsulate the second isolator element, or may be present at outer corners of the second isolator element. The second dielectric material may have a larger bandgap than the first dielectric material, and its configuration may reduce electrostatic charge injection into the first dielectric material. The micro-isolator may be formed using microfabrication techniques.
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公开(公告)号：US12080460B2
公开(公告)日：2024-09-03
申请号：US17890163
申请日：2022-08-17
发明人： Paul Lambkin , Patrick J. Murphy , Bernard Patrick Stenson , Laurence B. O'Sullivan , Stephen O'Brien , Shane Geary , Baoxing Chen , Sombel Diaham
CPC分类号： H01F19/08 , H01F2019/085 , H01G2/00 , H04B1/04 , H04B1/16
摘要： A micro-isolator is described. The micro-isolator may include a first isolator element, a second isolator element, and a first dielectric material separating the first isolator element from the second isolator element. A second dielectric material may completely or partly encapsulate the second isolator element, or may be present at outer corners of the second isolator element. The second dielectric material may have a larger bandgap than the first dielectric material, and its configuration may reduce electrostatic charge injection into the first dielectric material. The micro-isolator may be formed using microfabrication techniques.
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公开(公告)号：US20210065955A1
公开(公告)日：2021-03-04
申请号：US16553954
申请日：2019-08-28
发明人： Paul Lambkin , Patrick J. Murphy , Bernard Patrick Stenson , Laurence B. O'Sullivan , Stephen O'Brien , Shane Geary , Baoxing Chen , Sombel Diaham
IPC分类号： H01F19/08
摘要： A micro-isolator is described. The micro-isolator may include a first isolator element, a second isolator element, and a first dielectric material separating the first isolator element from the second isolator element. A second dielectric material may completely or partly encapsulate the second isolator element, or may be present at outer corners of the second isolator element. The second dielectric material may have a larger bandgap than the first dielectric material, and its configuration may reduce electrostatic charge injection into the first dielectric material. The micro-isolator may be formed using microfabrication techniques.
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