公开(公告)号：US07450342B2

公开(公告)日：2008-11-11

申请号：US11079052

申请日：2005-03-14

申请人： Andrew David White ,  Roger Lee Hipwell, Jr. ,  John R. Pendray ,  Bradley Jay VerMeer

发明人： Andrew David White ,  Roger Lee Hipwell, Jr. ,  John R. Pendray ,  Bradley Jay VerMeer

IPC分类号： G11B5/48 ,  G11B5/60

CPC分类号： G11B5/4853 ,  G11B5/484

摘要： A composite head-electrical conditioner assembly that includes a slider with a transducer head and transducer bond pads. The transducer bond pads communicate a transducer level electrical signal with the transducer head. An integrated circuit substrate has a conditioning circuit and first substrate bond pads electrically connected to the transducer bond pads. The integrated circuit substrate has second substrate bond pads with a conditioned electrical signal that is transmittable over a circuit. The slider is rigidly mounted to the integrated circuit substrate to form an assembly that is flexibly mountable. A thermal isolation space is provided between the transducer and the conditioning circuit. The integrated circuit can be in the form of a cap that provides windage reduction.

摘要翻译： 一种复合头 - 电调节器组件，其包括具有换能器头和换能器接合垫的滑块。 传感器接合焊盘将传感器电平信号与换能器头通信。 集成电路基板具有调节电路和电连接到换能器接合焊盘的第一基板接合焊盘。 集成电路衬底具有第二衬底接合焊盘，其具有可通过电路传输的经调节的电信号。 滑块刚性地安装到集成电路基板上以形成可灵活安装的组件。 在换能器和调节电路之间设有隔热空间。 集成电路可以是提供减少风量的帽子的形式。