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公开(公告)号：US07817100B2
公开(公告)日：2010-10-19
申请号：US11564515
申请日：2006-11-29
IPC分类号： H01Q1/42
CPC分类号： H01Q1/002 , Y10T29/49016
摘要： A ballistic resistant antenna for use with a ballistic resistant communications system having a first plate fabricated from a ballistic material. The first plate has at least one opening configured to allow transmission of electromagnetic energy at a predetermined range of electromagnetic wavelengths. The antenna also has at least one plug having a geometry that is capable of insertion into the at least one opening. The at least one plug is made up of a material that is substantially transparent to the predetermined range of electromagnetic wavelengths.
摘要翻译： 一种用于防弹通信系统的防弹天线，具有由弹道材料制成的第一板。 第一板具有至少一个开口，其被配置为允许在电磁波长的预定范围内传输电磁能。 天线还具有至少一个具有几何形状的插头，该几何形状能够插入至少一个开口中。 至少一个插头由对电磁波长的预定范围基本透明的材料构成。
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公开(公告)号：US20080116568A1
公开(公告)日：2008-05-22
申请号：US11602605
申请日：2006-11-21
申请人： Andrew G. Laquer , Ernest E. Bunch
发明人： Andrew G. Laquer , Ernest E. Bunch
IPC分类号： H01L23/34
CPC分类号： H01L23/473 , H01L23/44 , H01L2224/32225
摘要： The semiconductor package as well as a method for making it and using it is disclosed. The semiconductor package comprises a semiconductor chip having at least one heat-generating semiconductor device and a volumetrically expandable chamber disposed to sealingly surround the semiconductor chip, the volumetrically expandable chamber filled entirely with a non-electrically conductive liquid in contact with the semiconductor device and circulated within the volumetrically expandable chamber at least in part by the generated heat of the at least one semiconductor device to cool the at least one semiconductor device.
摘要翻译： 公开了半导体封装及其制造方法及其使用方法。 半导体封装包括半导体芯片，其具有至少一个发热半导体器件和设置成密封地围绕半导体芯片的容积扩展室，该体积可扩展室整体由与半导体器件接触的非导电液体填充并循环 至少部分地由所述至少一个半导体器件的产生的热量在所述容积扩张室内，以冷却所述至少一个半导体器件。
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公开(公告)号：US07656025B2
公开(公告)日：2010-02-02
申请号：US11602605
申请日：2006-11-21
申请人： Andrew G. Laquer , Ernest E. Bunch
发明人： Andrew G. Laquer , Ernest E. Bunch
IPC分类号： H01L23/34
CPC分类号： H01L23/473 , H01L23/44 , H01L2224/32225
摘要： The semiconductor package as well as a method for making it and using it is disclosed. The semiconductor package comprises a semiconductor chip having at least one heat-generating semiconductor device and a volumetrically expandable chamber disposed to sealingly surround the semiconductor chip, the volumetrically expandable chamber filled entirely with a non-electrically conductive liquid in contact with the semiconductor device and circulated within the volumetrically expandable chamber at least in part by the generated heat of the at least one semiconductor device to cool the at least one semiconductor device.
摘要翻译： 公开了半导体封装及其制造方法及其使用方法。 半导体封装包括半导体芯片，其具有至少一个发热半导体器件和设置成密封地围绕半导体芯片的容积扩展室，该容积扩张室整体由与半导体器件接触的非导电液体填充并循环 至少部分地由所述至少一个半导体器件的产生的热量在所述容积扩张室内，以冷却所述至少一个半导体器件。
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公开(公告)号：US06360084B1
公开(公告)日：2002-03-19
申请号：US09433511
申请日：1999-11-03
申请人： Andrew G. Laquer
发明人： Andrew G. Laquer
IPC分类号： H04B102
CPC分类号： H01J23/027 , H01J25/00
摘要： An RF transmitter, such as a radar transmitter or a communications amplifier, is provided that includes a plurality of RF power tube sections each sharing a common collector. The RF tube sections may comprise Klystron tubes, TWT tubes or other RF power tubes known in the art. A common modulator is also typically provided to modulate electron beams produced in each of the plurality of tube sections. The RF transmitter according to the present invention is considerably lighter and smaller relative to known multi-band RF transmitter structures that employ separate collectors and modulators. An associated RF amplification method that employs a common collector is also provided.
摘要翻译： 提供了诸如雷达发射机或通信放大器的RF发射机，其包括多个共享共同收集器的RF功率管段。 RF管段可以包括本领域已知的速调管，TWT管或其它RF功率管。 通常还提供一个共同的调制器来调制在多个管段中的每一个中产生的电子束。 与使用分开的收集器和调制器的已知多频带RF发射机结构相比，根据本发明的RF发射机相对较轻且更小。 还提供了使用公共收集器的相关RF放大方法。
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公开(公告)号：US08592971B2
公开(公告)日：2013-11-26
申请号：US12638776
申请日：2009-12-15
申请人： Andrew G. Laquer , Ernest E. Bunch
发明人： Andrew G. Laquer , Ernest E. Bunch
IPC分类号： H01L23/34
CPC分类号： H01L23/473 , H01L23/44 , H01L2224/32225
摘要： The semiconductor package as well as a method for making it and using it is disclosed. The semiconductor package comprises a semiconductor chip having at least one heat-generating semiconductor device and a volumetrically expandable chamber disposed to sealingly surround the semiconductor chip, the volumetrically expandable chamber filled entirely with a non-electrically conductive liquid in contact with the semiconductor device and circulated within the volumetrically expandable chamber at least in part by the generated heat of the at least one semiconductor device to cool the at least one semiconductor device.
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公开(公告)号：US20100133685A1
公开(公告)日：2010-06-03
申请号：US12638776
申请日：2009-12-15
申请人： Andrew G. Laquer , Ernest E. Bunch
发明人： Andrew G. Laquer , Ernest E. Bunch
IPC分类号： H01L23/42 , H01L23/473 , F28D15/00
CPC分类号： H01L23/473 , H01L23/44 , H01L2224/32225
摘要： The semiconductor package as well as a method for making it and using it is disclosed. The semiconductor package comprises a semiconductor chip having at least one heat-generating semiconductor device and a volumetrically expandable chamber disposed to sealingly surround the semiconductor chip, the volumetrically expandable chamber filled entirely with a non-electrically conductive liquid in contact with the semiconductor device and circulated within the volumetrically expandable chamber at least in part by the generated heat of the at least one semiconductor device to cool the at least one semiconductor device.
摘要翻译： 公开了半导体封装及其制造方法及其使用方法。 半导体封装包括半导体芯片，其具有至少一个发热半导体器件和设置成密封地围绕半导体芯片的容积扩展室，该体积可扩展室整体由与半导体器件接触的非导电液体填充并循环 至少部分地由所述至少一个半导体器件的产生的热量在所述容积扩张室内，以冷却所述至少一个半导体器件。
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公开(公告)号：US5167386A
公开(公告)日：1992-12-01
申请号：US822770
申请日：1992-01-21
申请人： Andrew G. Laquer , Albert L. Bien
发明人： Andrew G. Laquer , Albert L. Bien
摘要： Pyrotechnic removal of a radome cover may be accomplished by scoring longitudinal recesses 50, preferably at least four, on the inner surface 26 of the cover 18. Explosives cord 38, shaped to preferentially detonate outward, is placed in the recesses 50, and is backed with a backing 48 to prevent damage to the underlying radome 12. Annular explosive cord sections 40 and 42 are placed at the nose 28 and rear end 20 of the radome cover 18. A detonator 34 explodes all cords simultaneously.
摘要翻译： 烟囱罩的除烟可以通过在盖18的内表面26上划分纵向凹槽50，优选至少四个来实现。成形为优先向外引爆的爆炸物绳38被放置在凹部50中，并被支撑 具有背衬48以防止对下面的天线罩12的损坏。环形爆炸绳索部分40和42被放置在天线罩盖18的鼻部28和后端20处。雷管34同时爆炸所有绳索。
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