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    Manufacturing method of semiconductor device
    2.
    发明授权
    Manufacturing method of semiconductor device 有权
    半导体器件的制造方法

    公开(公告)号：US07064046B2

    公开(公告)日：2006-06-20

    申请号：US10771497

    申请日：2004-02-05

    申请人： Motoaki Wakui ,  Isao Ochiai ,  Ron Eyal ,  Gil Shetrit

    发明人： Motoaki Wakui ,  Isao Ochiai ,  Ron Eyal ,  Gil Shetrit

    IPC分类号： H01L21/30 ,  H01L21/46

    CPC分类号： H01L21/78

    摘要： The invention provides an algorithm for aligning a rotating blade in a dicing process of partially dicing a wafer attached to a substrate. A width of a cut groove and distance between pads in the cut groove are detected by a recognition camera. Based on a result of this detection, alignment data Δy which is distance between a centerline of the width of the cut groove and a real centerline are calculated. Based on a difference between the distance of the pads in the cut groove and a target value of the distance, data Δz on alignment in a depth direction of the cut groove is calculated. The rotating blade is aligned by using the alignment data Δy and Δz.

    摘要翻译： 本发明提供了一种用于在切割附着于基底的晶片的切割工艺中对准旋转刀片的算法。 切割槽的宽度和切割槽中的焊盘之间的距离由识别照相机检测。 基于该检测的结果，计算作为切割槽的宽度的中心线与实际中心线之间的距离的对准数据Deltay。 基于切槽中的焊盘的距离与距离的目标值之间的差异，计算切割槽的深度方向上的对准的数据Deltaz。 旋转刀片通过使用对准数据Deltay和Deltaz对齐。

    Manufacturing method of semiconductor device
    4.
    发明申请
    Manufacturing method of semiconductor device 有权
    半导体器件的制造方法

    公开(公告)号：US20050009302A1

    公开(公告)日：2005-01-13

    申请号：US10771497

    申请日：2004-02-05

    申请人： Motoaki Wakui ,  Isao Ochiai ,  Ron Eyal ,  Gil Shetrit

    发明人： Motoaki Wakui ,  Isao Ochiai ,  Ron Eyal ,  Gil Shetrit

    IPC分类号： H01L21/301 ,  H01L21/44 ,  H01L21/46 ,  H01L21/66 ,  H01L21/78

    CPC分类号： H01L21/78

    摘要： The invention provides an algorithm for aligning a rotating blade in a dicing process of partially dicing a wafer attached to a substrate. A width of a cut groove and distance between pads in the cut groove are detected by a recognition camera. Based on a result of this detection, alignment data Δy which is distance between a centerline of the width of the cut groove and a real centerline are calculated. Based on a difference between the distance of the pads in the cut groove and a target value of the distance, data Δz on alignment in a depth direction of the cut groove is calculated. The rotating blade is aligned by using the alignment data Δy and Δz.

    摘要翻译： 本发明提供了一种用于在切割附着于基底的晶片的切割工艺中对准旋转刀片的算法。 切割槽的宽度和切割槽中的焊盘之间的距离由识别照相机检测。 基于该检测的结果，计算作为切割槽的宽度的中心线与实际中心线之间的距离的对准数据Deltay。 基于切槽中的焊盘的距离与距离的目标值之间的差异，计算切割槽的深度方向上的对准的数据Deltaz。 旋转刀片通过使用对准数据Deltay和Deltaz对齐。

    Method of customizing audio tracks
    5.
    发明申请
    Method of customizing audio tracks 审中-公开
    定制音轨的方法

    公开(公告)号：US20060028951A1

    公开(公告)日：2006-02-09

    申请号：US11195530

    申请日：2005-08-01

    申请人： Ned Tozun ,  Ron Eyal

    发明人： Ned Tozun ,  Ron Eyal

    IPC分类号： G11B3/64

    CPC分类号： G11B3/64

    摘要： A method for creating a customized audio track involves the steps of creating a song template, and then defining insert regions where sounds, vocals, or the like are inserted into the template. The invention includes the steps of generating a list of inserts, and pre-recording or otherwise acquiring a recording of each insert. When a particular insert is selected, it is introduced into the insert region, and the customized audio track may be recorded, streamed, or otherwise used or delivered to a listener. The audio track may comprise a personalized song (using appropriate name inserts) or a cell phone ring tone that identifies the caller.

    摘要翻译： 用于创建定制音轨的方法涉及创建歌曲模板的步骤，然后定义将声音，声乐等插入到模板中的插入区域。 本发明包括以下步骤：生成插入物列表，并且预先记录或以其他方式获取每个插入物的记录。 当选择特定的插入时，将其引入到插入区域中，并且定制的音轨可以被记录，流式传输或以其他方式使用或传递给收听者。 音频轨道可以包括个性化歌曲（使用适当的名称插入）或识别呼叫者的蜂窝电话铃音。