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    TOUCH SENSOR AND METHOD OF FORMING A TOUCH SENSOR
    1.
    发明申请
    TOUCH SENSOR AND METHOD OF FORMING A TOUCH SENSOR 有权
    触摸传感器和形成触摸传感器的方法

    公开(公告)号：US20120325639A1

    公开(公告)日：2012-12-27

    申请号：US13164394

    申请日：2011-06-20

    申请人： Antonino Scuderi ,  Ezio Perrone

    发明人： Antonino Scuderi ,  Ezio Perrone

    IPC分类号： H03K17/975

    CPC分类号： G06F3/044 ,  G06F2203/04111

    摘要： A touch sensor includes a substrate having a substrate surface and first electrode sets. Each first electrode set has a plurality of electrodes formed over the substrate surface and arranged in a row along a first direction, the electrodes being transparent and formed of a first material, the first material being electrically conductive and light transmissive. Each first electrode set also has connection elements. Each connection element provides an electrical connection between a pair of adjacent ones of the plurality of electrodes. The connection elements are formed of a second material having a smaller specific electric resistance than the first material. Each of the connection elements comprises a first portion, a second portion and a third portion. The third portion provides an electrical connection between the first portion and the second portion.

    摘要翻译： 触摸传感器包括具有基板表面和第一电极组的基板。 每个第一电极组具有形成在衬底表面上并沿着第一方向排成一列的多个电极，电极是透明的并由第一材料形成，第一材料是导电的和透光的。 每个第一电极组还具有连接元件。 每个连接元件提供多个电极中的一对相邻电极之间的电连接。 连接元件由具有比第一材料更小的比电阻的第二材料形成。 每个连接元件包括第一部分，第二部分和第三部分。 第三部分提供第一部分和第二部分之间的电连接。

    Touch sensor and method of forming a touch sensor
    2.
    发明授权
    Touch sensor and method of forming a touch sensor 有权
    触摸传感器和形成触摸传感器的方法

    公开(公告)号：US08698029B2

    公开(公告)日：2014-04-15

    申请号：US13164394

    申请日：2011-06-20

    申请人： Antonino Scuderi ,  Ezio Perrone

    发明人： Antonino Scuderi ,  Ezio Perrone

    IPC分类号： H03K17/975

    CPC分类号： G06F3/044 ,  G06F2203/04111

    摘要： A touch sensor includes a substrate having a substrate surface and first electrode sets. Each first electrode set has a plurality of electrodes formed over the substrate surface and arranged in a row along a first direction, the electrodes being transparent and formed of a first material, the first material being electrically conductive and light transmissive. Each first electrode set also has connection elements. Each connection element provides an electrical connection between a pair of adjacent ones of the plurality of electrodes. The connection elements are formed of a second material having a smaller specific electric resistance than the first material. Each of the connection elements comprises a first portion, a second portion and a third portion. The third portion provides an electrical connection between the first portion and the second portion.

    摘要翻译： 触摸传感器包括具有基板表面和第一电极组的基板。 每个第一电极组具有形成在衬底表面上并沿着第一方向排成一列的多个电极，电极是透明的并由第一材料形成，第一材料是导电的和透光的。 每个第一电极组还具有连接元件。 每个连接元件提供多个电极中的一对相邻电极之间的电连接。 连接元件由具有比第一材料更小的比电阻的第二材料形成。 每个连接元件包括第一部分，第二部分和第三部分。 第三部分提供第一部分和第二部分之间的电连接。

    Directional coupler architecture for radio frequency power amplifier
    3.
    发明授权
    Directional coupler architecture for radio frequency power amplifier 有权
    射频功率放大器的定向耦合器结构

    公开(公告)号：US08699975B1

    公开(公告)日：2014-04-15

    申请号：US13363905

    申请日：2012-02-01

    申请人： Bernd Schleicher ,  Ezio Perrone ,  Christian Bildl ,  Volker Wannenmacher

    发明人： Bernd Schleicher ,  Ezio Perrone ,  Christian Bildl ,  Volker Wannenmacher

    IPC分类号： H04B1/04 ,  H03G3/30 ,  H01P5/16

    CPC分类号： H03G3/3042 ,  H01P5/16 ,  H03F3/24

    摘要： Various embodiments may provide a circuit including a radio frequency (RF) power amplification module having an RF power amplifier. The RF power amplification module may further include a directional coupler coupled with the RF power amplifier and configured to produce a power signal at a coupling port of the directional coupler corresponding to an output power of the RF power amplifier. The RF power amplification module may further include a switch coupled between the coupling terminal and a sensing path to selectively couple the coupling port with a power detector via the sensing path. The RF power amplification module may further include a termination load coupled to an isolation port of the directional coupler. Some embodiments may include a plurality of RF power amplification modules coupled together by the sensing path.

    摘要翻译： 各种实施例可以提供包括具有RF功率放大器的射频（RF）功率放大模块的电路。 RF功率放大模块还可以包括与RF功率放大器耦合的定向耦合器，并被配置为在定向耦合器的耦合端口处产生对应于RF功率放大器的输出功率的功率信号。 RF功率放大模块还可以包括耦合在耦合端子和感测路径之间的开关，以通过感测路径选择性地将耦合端口与功率检测器耦合。 RF功率放大模块还可以包括耦合到定向耦合器的隔离端口的终端负载。 一些实施例可以包括通过感测路径耦合在一起的多个RF功率放大模块。