Thin-film capacitor
    1.
    发明授权
    Thin-film capacitor 失效
    薄膜电容器

    公开(公告)号:US06337790B1

    公开(公告)日:2002-01-08

    申请号:US09385279

    申请日:1999-08-30

    IPC分类号: H01G4228

    CPC分类号: H01G2/20 H01G2/14

    摘要: The present invention provides a new type of thin-film capacitor which is insensitive to breakdown voltages during its mounting on a printed circuit board. Said capacitor has an insulating substrate having at least two internal electrode layers which are mutually separated by means of a dielectric layer. The substrate also has two end contacts each of which are electroconductively connected to one of said internal electrode layers. According to the invention, the capacitor also has breakable electrically conductive means, preferably formed as a metal layer, which means are electrically connected to said end contacts. The presence of said breakable electrically conductive means between said end contacts prevents damage due to electrical storage which can arise during the mounting of the capacitor on a printed circuit board.

    摘要翻译: 本发明提供了一种新型薄膜电容器,其在其安装在印刷电路板上时对击穿电压不敏感。 所述电容器具有绝缘基板,该绝缘基板具有至少两个通过介电层相互分离的内部电极层。 基板还具有两个端部触头,每个触头都与所述内部电极层中的一个导电连接。 根据本发明,电容器还具有可破坏的导电装置,优选地形成为金属层,该装置电连接到所述端触点。 在所述端部触点之间存在所述可破坏的导电装置可以防止由于在将电容器安装在印刷电路板上时可能引起的电存储的损坏。

    Multiple-component unit
    2.
    发明授权
    Multiple-component unit 有权
    多组件单元

    公开(公告)号:US06507498B1

    公开(公告)日:2003-01-14

    申请号:US09491626

    申请日:2000-01-26

    IPC分类号: H03H102

    CPC分类号: H03H1/00

    摘要: The invention relates to a multiple-component unit in which at least two passive components have been realized one above the other. A multiple-component unit thus comprises at least one resistor and at least one capacitor, or at least two capacitors. This space-saving construction allows for a miniaturization of circuits. A further miniaturization can be achieved in that the multiple-component units are not manufactured as discrete components, but are integrated into ICs.

    摘要翻译: 本发明涉及一种多组件单元,其中至少两个无源部件已经彼此上下实现。 因此,多组分单元包括至少一个电阻器和至少一个电容器,或至少两个电容器。 这种节省空间的结构允许电路的小型化。 可以实现进一步的小型化,因为多组分单元不是作为分立组件制造的,而是集成到IC中。