公开(公告)号：US5750417A

公开(公告)日：1998-05-12

申请号：US423247

申请日：1995-04-13

申请人： Antonius J. M. Nellissen

发明人： Antonius J. M. Nellissen

IPC分类号： H01L23/48 ,  H01L21/00 ,  H01L21/48 ,  H01L23/13 ,  H01L23/24 ,  H01L23/538 ,  H05K1/00 ,  H05K3/00 ,  H05K3/06 ,  H05K3/40 ,  H01L21/52 ,  H01L21/58 ,  H01L21/60

CPC分类号： H01L23/13 ,  H01L21/4846 ,  H01L23/24 ,  H01L23/5385 ,  H05K3/0082 ,  H01L2224/16225 ,  H05K1/0284 ,  H05K2201/09645 ,  H05K3/064 ,  H05K3/403

摘要： A method of manufacturing a device which starts with a support bar with a first main surface provided with a groove suitable for accommodating a semiconductor element. The groove has walls on which conductor tracks are provided which continue over the first main surface. This method is particularly suitable for making support bars which serve as envelopes for semiconductor elements. The conductor tracks are provided through patterning of a conductive material by means of a patterned photoresist which is provided on the support bar and irradiated from two directions, at such an angle to the first main surface and to the groove that the bottom of the groove is not irradiated, whereas portions of the walls and of the first main surface are irradiated, after which the photoresist and an applied layer of conductive material are brought into a pattern. This method is more reliable than the known method. In the new method, the geometry of the support bar is used for irradiating the photoresist. An edge of the groove screens the bottom of the groove from irradiation. Irradiation from two directions insures that the photoresist on the first main surface and on both walls of the groove is irradiated.

摘要翻译： 一种制造装置的方法，该装置从具有适于容纳半导体元件的槽的第一主表面的支撑杆开始。 凹槽具有壁，在该壁上设置导体轨道，其继续在第一主表面上。 该方法特别适用于制造用作半导体元件的封套的支撑杆。 导体轨道通过图案化的导电材料提供，该图案化的光致抗蚀剂设置在支撑杆上，并从两个方向以与第一主表面成角度的方向照射到槽的底部 没有照射，而是照射壁和第一主表面的一部分，然后使光致抗蚀剂和涂覆的导电材料层成为图案。 该方法比已知方法更可靠。 在新方法中，支撑杆的几何形状用于照射光致抗蚀剂。 凹槽的边缘从辐射屏蔽槽的底部。 从两个方向的照射确保照射第一主表面上的光致抗蚀剂和两个壁上的光致抗蚀剂。

公开(公告)号：US5686230A

公开(公告)日：1997-11-11

申请号：US423243

申请日：1995-04-13

申请人： Antonius J. M. Nellissen

发明人： Antonius J. M. Nellissen

IPC分类号： H05K3/06 ,  G03F7/20 ,  G03F7/24 ,  H01L21/60 ,  H05K1/00 ,  H05K3/00 ,  H05K3/02 ,  H05K3/40

CPC分类号： G03F7/703 ,  G03F7/24 ,  H05K3/0082 ,  H05K1/0284 ,  H05K2201/09018 ,  H05K2203/056 ,  H05K2203/135 ,  H05K3/064 ,  H05K3/403

摘要： A method of manufacturing a device provided with a body with a surface, at least a portion of the surface being provided with a radiation-sensitive layer, after which portions of the radiation-sensitive layer are exposed to radiation through a mask, a first portion of the layer being irradiated directly using a first part of a radiation beam projected through the mask and a second portion of the layer being irradiated indirectly using a second part of the radiation beam projected through the mask and reflected onto the second portion, the radiation beam being substantially collimated.

摘要翻译： 一种制造具有表面的主体的装置的方法，所述表面的至少一部分设置有辐射敏感层，之后辐射敏感层的一部分通过掩模暴露于辐射，第一部分 使用投射穿过掩模的辐射束的第一部分直接照射该层，并且该层的第二部分被间接照射，该辐射束的第二部分通过掩模投射并反射到第二部分上，辐射束 基本准直。

公开(公告)号：US06337790B1

公开(公告)日：2002-01-08

申请号：US09385279

申请日：1999-08-30

申请人： Antonius J. M. Nellissen ,  Paul Van Oppen ,  Hans P. Lobl ,  Mareike K. Klee ,  Wilhelm A. Groen ,  Nicolaas J. A. Van Veen

发明人： Antonius J. M. Nellissen ,  Paul Van Oppen ,  Hans P. Lobl ,  Mareike K. Klee ,  Wilhelm A. Groen ,  Nicolaas J. A. Van Veen

IPC分类号： H01G4228

CPC分类号： H01G2/20 ,  H01G2/14

摘要： The present invention provides a new type of thin-film capacitor which is insensitive to breakdown voltages during its mounting on a printed circuit board. Said capacitor has an insulating substrate having at least two internal electrode layers which are mutually separated by means of a dielectric layer. The substrate also has two end contacts each of which are electroconductively connected to one of said internal electrode layers. According to the invention, the capacitor also has breakable electrically conductive means, preferably formed as a metal layer, which means are electrically connected to said end contacts. The presence of said breakable electrically conductive means between said end contacts prevents damage due to electrical storage which can arise during the mounting of the capacitor on a printed circuit board.

摘要翻译： 本发明提供了一种新型薄膜电容器，其在其安装在印刷电路板上时对击穿电压不敏感。 所述电容器具有绝缘基板，该绝缘基板具有至少两个通过介电层相互分离的内部电极层。 基板还具有两个端部触头，每个触头都与所述内部电极层中的一个导电连接。 根据本发明，电容器还具有可破坏的导电装置，优选地形成为金属层，该装置电连接到所述端触点。 在所述端部触点之间存在所述可破坏的导电装置可以防止由于在将电容器安装在印刷电路板上时可能引起的电存储的损坏。

公开(公告)号：US07514856B2

公开(公告)日：2009-04-07

申请号：US10515743

申请日：2003-05-23

申请人： Arnd Ritz ,  Antonius J. M. Nellissen

发明人： Arnd Ritz ,  Antonius J. M. Nellissen

IPC分类号： H01J7/24 ,  H01J1/02

CPC分类号： H01J9/22

摘要： A method of manufacturing partial layers on lamp bulbs, in which method functional layers are provided in thin-film technology, and which method includes at least providing a temporary layer on that region of the lamp bulb which will have no functional layer in the operational state of the lamp, subsequently providing the functional layer on the entire surface of the lamp bulb, and detaching the temporary layer together with the functional layer present thereon.

摘要翻译： 一种在灯泡上制造部分层的方法，其中以薄膜技术提供功能层，并且该方法至少在灯泡的该区域上提供暂时层，该层将不具有操作状态的功能层 随后在灯泡的整个表面上提供功能层，以及将临时层与存在于其上的功能层一起分离。

公开(公告)号：US06240621B1

公开(公告)日：2001-06-05

申请号：US09128837

申请日：1998-08-04

申请人： Antonius J. M. Nellissen ,  Erik C. E. van Grunsven

发明人： Antonius J. M. Nellissen ,  Erik C. E. van Grunsven

IPC分类号： H01F706

CPC分类号： H01G13/00 ,  H05K1/0306 ,  H05K3/0052 ,  H05K3/0082 ,  H05K3/0097 ,  H05K3/108 ,  H05K3/3442 ,  H05K3/388 ,  H05K3/403 ,  H05K2201/0317 ,  Y10T29/435 ,  Y10T29/49004 ,  Y10T29/4902

摘要： A method of manufacturing a plurality of thin-film, surface-mountable, electronic components, comprising the following successive steps: providing a substantially planar, ceramic substrate having a first and second major surface which are mutually parallel, the substrate containing a series of mutually parallel slots which extend from the first major surface through to the second major surface, such slots serving to subdivide the substrate into elongated segments extending parallel to the slots and located between consecutive pairs thereof, each segment having two oppositely located walls extending along the edges of the adjacent slots, each segment carrying a thin-film electrode structure on at least one of its first and second major surfaces; with the aid of a three-dimensional lithographic technique, providing electrical contacts which extend along both walls of each segment and which make electrical contact with the electrode structure on each segment; severing the segments into individual block-shaped components by severing them along a series of division lines extending substantially perpendicular to the walls of each segment. This method can be used to manufacture various types of component, such as thin-film resistors, fuses, capacitors and inductors, but also passive networks, such as RC and LCR networks.

摘要翻译： 一种制造多个薄膜，可表面安装的电子部件的方法，包括以下连续步骤：提供具有彼此平行的第一和第二主表面的基本平坦的陶瓷基板，所述基板包含一系列相互平行的 平行的槽从第一主表面延伸到第二主表面，这样的槽用于将基板细分成平行于槽延伸并且位于连续对之间的细长段，每个段具有两个相对定位的壁，沿着 相邻的槽，每个段在其第一和第二主表面中的至少一个上承载薄膜电极结构; 借助于三维光刻技术，提供沿每个段的两个壁延伸并且与每个段上的电极结构电接触的电接触; 通过沿着基本上垂直于每个段的壁延伸的一系列分割线将它们切断，将段切割成单个的块状部件。 该方法可用于制造各种类型的元件，如薄膜电阻，保险丝，电容和电感，还可用于无源网络，如RC和LCR网络。

公开(公告)号：US06226170B1

公开(公告)日：2001-05-01

申请号：US09294610

申请日：1999-04-19

申请人： Antonius J. M. Nellissen ,  Gerrit P. Van Der Beek ,  Willem R. De Wild

发明人： Antonius J. M. Nellissen ,  Gerrit P. Van Der Beek ,  Willem R. De Wild

IPC分类号： H01G4228

CPC分类号： H01G4/08

摘要： A thin-film capacitor comprises an electrically insulating substrate which is provided with at least two inner electrodes which are separated from each other by means of the dielectric layer. The capacitor also includes two end contacts which each electroconductively contact one of the inner electrodes. The electroconductive contact takes place via a through-connection which communicates exclusively with the main surface of the inner electrode. By virtue of this measure, it is achieved that the contact resistance between the end contacts and the inner electrodes is relatively low and reproducible. As a result, also the value of the ESR of the thin-film capacitor is low, so that the capacitor can very suitably be used for high-frequency applications.

摘要翻译： 薄膜电容器包括电绝缘基板，其被设置有至少两个通过介电层彼此分离的内部电极。 电容器还包括两个末端触点，每个端部触点都与内部电极之一导电接触。 导电接触通过与内部电极的主表面专门通信的通孔连接进行。 通过这种措施，实现了端部触点和内部电极之间的接触电阻相对低且可再现。 结果，薄膜电容器的ESR的值也低，使得电容器可以非常适合地用于高频应用。

公开(公告)号：US5937493A

公开(公告)日：1999-08-17

申请号：US622506

申请日：1996-03-25

申请人： Antonius J. M. Nellissen

发明人： Antonius J. M. Nellissen

IPC分类号： H01G4/33 ,  H01G4/30 ,  H01G4/38 ,  H01L21/203 ,  H01L21/301 ,  H01L23/522 ,  H01L41/083 ,  H01L41/316 ,  H01L41/338 ,  H01G7/00

CPC分类号： H01G4/306 ,  H01L41/0475 ,  H01L41/083 ,  H01L41/0833 ,  H01L41/316 ,  H01L41/338 ,  Y10T29/42 ,  Y10T29/435 ,  Y10T29/49099

摘要： A method of manufacturing a plurality of electronic multilayer components is disclosed in which each multilayer component comprises alternately stacked electrically conductive layers and electrically insulating layers, the electrically conductive layers being electrically connected in a periodically alternate arrangement to different edges of the multilayer component. The method comprises the steps of providing a substrate which is endowed with a regular pattern of surface protrusions on one face; depositing individual multilayer components into intervening spaces delimited by the protrusions; depositing electrically conductive layers for connection to a given edge of a multilayer component, wherein each connection occurs at an angle (.theta.) of less than 90.degree. with respect to the substrate face in a direction extending towards the surface protrusion delimiting the respective edge; depositing each electrically insulating layer so as to completely cover a preceding electrically conductive layer; after deposition of the desired multilayer composition, planing the side of the substrate on which deposition occurred so as to expose edges of the electrically conductive layers; depositing a connecting body of electrically conductive material over selected groupings of the exposed edges; and separating completed individual multilayer components from one another by severing the substrate along the surface protrusions.

摘要翻译： 公开了一种制造多个电子多层组件的方法，其中每个多层组件包括交替堆叠的导电层和电绝缘层，导电层以周期性交替的方式电连接到多层部件的不同边缘。 该方法包括以下步骤：在一个面上提供具有规则的表面突起图案的基底; 将各个多层组件沉积在由突起界定的中间空间中; 沉积用于连接到多层部件的给定边缘的导电层，其中每个连接在朝着朝向相应边缘的表面突起延伸的方向上相对于所述基板面以小于90°的角度（θ）发生; 沉积每个电绝缘层以完全覆盖之前的导电层; 在沉积所需的多层组合物之后，对发生沉积的衬底的一侧进行平面化以暴露导电层的边缘; 在所选择的暴露边缘的组上沉积导电材料的连接体; 以及通过沿着所述表面突起切断所述基底而将完成的单个多层部件彼此分离。

公开(公告)号：US5875531A

公开(公告)日：1999-03-02

申请号：US622509

申请日：1996-03-25

申请人： Antonius J. M. Nellissen ,  Erik C. E. Van Grunsven

发明人： Antonius J. M. Nellissen ,  Erik C. E. Van Grunsven

IPC分类号： H01G4/12 ,  C23C14/04 ,  H01G4/30 ,  H01G4/33 ,  H01L41/083 ,  H01L41/316 ,  H01L41/338 ,  H01G7/00

CPC分类号： H01G4/306 ,  H01L41/0475 ,  H01L41/083 ,  H01L41/316 ,  H01L41/338 ,  Y10T29/42 ,  Y10T29/435 ,  Y10T29/49099

摘要： A method of manufacturing a plurality of electronic multilayer component search of which alternately stacked electrically conductive and insulating layers alternately connected to opposite edges of the component, which method comprises: providing a substrate having a face endowed with a regular pattern of substantially parallel elongated protrusions separated by valleys; providing a first and a second flux of electrically conductive material in a direction subtending an angle of less than 90 with the substrate face and extending substantially parallel to the surface protrusions, and covering the thus-formed electrically conductive layers with intervening electrically insulating layers, the first and second fluxes having substantially oppositely directed in-plane components; providing said first and second fluxes with intervening insulating layers in an alternate manner as often as desired; dividing the substrate into strips, each including a protrusion, by severing the substrate along a series of planes, each of which plane extends along a valley in a direction substantially parallel to the protrusions; and providing electrically conductive material upon each resulting exposed side faces of the strips so as to provide a mutual electrical contact between the electrically conductive layers terminating in that exposed side face.

摘要翻译： 一种制造多个电子多层成分搜索的方法，其中交替层叠的导电和绝缘层交替地连接到部件的相对边缘，该方法包括：提供具有被分配有基本上平行的细长突起的规则图案的基底的基底 通过山谷 在与衬底面成对角度小于90°的方向上提供第一和第二通量的导电材料，并基本上平行于表面突起延伸，并用中间的电绝缘层覆盖这样形成的导电层， 第一和第二焊剂具有基本相反的面内部件; 根据需要以交替的方式提供具有中间绝缘层的所述第一和第二通量; 将衬底分成条带，每个条带包括突起，通过沿一系列平面切断基片，每个平面各自的平面沿着基本上平行于突起的方向的谷部延伸; 并且在每个所得的暴露的条带的侧面上提供导电材料，以便在终止于该暴露侧面的导电层之间提供相互电接触。