公开(公告)号：US20220021179A1

公开(公告)日：2022-01-20

申请号：US17379759

申请日：2021-07-19

Applicant: Apple Inc.

Inventor： SeungJae Lee ,  Brett Sawyer ,  Chia-Te Chou ,  Jerry Byrd ,  Hooman Abediasl

IPC: H01S5/0225 ,  H01S5/02 ,  H01S5/0239

Abstract: Embodiments are directed to a photonic device that includes a first substrate defining a surface and a trench forming a depression along a portion of the surface, and a second substrate coupled with the surface and extending from the surface to form a raised portion around the trench. The photonic device can also include a laser die positioned within the trench, such that the laser die is surrounded by the second substrate, and an optical material positioned within a region between the laser die and the second substrate. The photonic device can further include a third substrate coupled with the second substrate such that the second substrate is positioned between the first substrate and the third substrate such that the second substrate is configured to at least partially isolate the laser die from mechanical stress exerted on the optical device.

公开(公告)号：US12218479B2

公开(公告)日：2025-02-04

申请号：US17379759

申请日：2021-07-19

Applicant: Apple Inc.

Inventor： SeungJae Lee ,  Brett Sawyer ,  Chia-Te Chou ,  Jerry Byrd ,  Hooman Abediasl

IPC: H01S5/0225 ,  H01S5/02 ,  H01S5/0239

Abstract: Embodiments are directed to a photonic device that includes a first substrate defining a surface and a trench forming a depression along a portion of the surface, and a second substrate coupled with the surface and extending from the surface to form a raised portion around the trench. The photonic device can also include a laser die positioned within the trench, such that the laser die is surrounded by the second substrate, and an optical material positioned within a region between the laser die and the second substrate. The photonic device can further include a third substrate coupled with the second substrate such that the second substrate is positioned between the first substrate and the third substrate such that the second substrate is configured to at least partially isolate the laser die from mechanical stress exerted on the optical device.

公开(公告)号：US20250149850A1

公开(公告)日：2025-05-08

申请号：US19014076

申请日：2025-01-08

Applicant: Apple Inc.

Inventor： SeungJae Lee ,  Brett Sawyer ,  Chia-Te Chou ,  Jerry Byrd ,  Hooman Abediasl

IPC: H01S5/0225 ,  H01S5/02 ,  H01S5/0239

Abstract: Embodiments are directed to a photonic device that includes a first substrate defining a surface and a trench forming a depression along a portion of the surface, and a second substrate coupled with the surface and extending from the surface to form a raised portion around the trench. The photonic device can also include a laser die positioned within the trench, such that the laser die is surrounded by the second substrate, and an optical material positioned within a region between the laser die and the second substrate. The photonic device can further include a third substrate coupled with the second substrate such that the second substrate is positioned between the first substrate and the third substrate such that the second substrate is configured to at least partially isolate the laser die from mechanical stress exerted on the optical device.