公开(公告)号：US12218479B2

公开(公告)日：2025-02-04

申请号：US17379759

申请日：2021-07-19

Applicant: Apple Inc.

Inventor： SeungJae Lee ,  Brett Sawyer ,  Chia-Te Chou ,  Jerry Byrd ,  Hooman Abediasl

IPC: H01S5/0225 ,  H01S5/02 ,  H01S5/0239

Abstract: Embodiments are directed to a photonic device that includes a first substrate defining a surface and a trench forming a depression along a portion of the surface, and a second substrate coupled with the surface and extending from the surface to form a raised portion around the trench. The photonic device can also include a laser die positioned within the trench, such that the laser die is surrounded by the second substrate, and an optical material positioned within a region between the laser die and the second substrate. The photonic device can further include a third substrate coupled with the second substrate such that the second substrate is positioned between the first substrate and the third substrate such that the second substrate is configured to at least partially isolate the laser die from mechanical stress exerted on the optical device.

公开(公告)号：US12197020B2

公开(公告)日：2025-01-14

申请号：US18079672

申请日：2022-12-12

Applicant: Apple Inc.

Inventor： Alfredo Bismuto ,  Mark Arbore ,  Jason Pelc ,  Hooman Abediasl ,  Andrea Trita

IPC: G02B6/42 ,  G02B6/00 ,  G02B6/02 ,  G02B6/293

Abstract: This disclosure relates to the layout of optical components included in a photonics integrated circuit (PIC) and the routing of optical traces between the optical components. The optical components can include light sources, a detector array, and a combiner. The optical components can be located in different regions of a substrate of the PIC, where the regions may include one or more types of active optical components, but also may exclude other types of active optical components. The optical traces can include a first plurality of optical traces for routing signals between light sources and a detector array, where the first plurality of optical traces can be located in an outer region of the substrate. The optical traces can also include a second plurality of optical traces for routing signals between the light sources and a combiner, where the second plurality of optical traces can be located in regions between banks of the light sources.

公开(公告)号：US20220021179A1

公开(公告)日：2022-01-20

申请号：US17379759

申请日：2021-07-19

Applicant: Apple Inc.

Inventor： SeungJae Lee ,  Brett Sawyer ,  Chia-Te Chou ,  Jerry Byrd ,  Hooman Abediasl

IPC: H01S5/0225 ,  H01S5/02 ,  H01S5/0239

Abstract: Embodiments are directed to a photonic device that includes a first substrate defining a surface and a trench forming a depression along a portion of the surface, and a second substrate coupled with the surface and extending from the surface to form a raised portion around the trench. The photonic device can also include a laser die positioned within the trench, such that the laser die is surrounded by the second substrate, and an optical material positioned within a region between the laser die and the second substrate. The photonic device can further include a third substrate coupled with the second substrate such that the second substrate is positioned between the first substrate and the third substrate such that the second substrate is configured to at least partially isolate the laser die from mechanical stress exerted on the optical device.

公开(公告)号：US20250149850A1

公开(公告)日：2025-05-08

申请号：US19014076

申请日：2025-01-08

Applicant: Apple Inc.

Inventor： SeungJae Lee ,  Brett Sawyer ,  Chia-Te Chou ,  Jerry Byrd ,  Hooman Abediasl

IPC: H01S5/0225 ,  H01S5/02 ,  H01S5/0239

Abstract: Embodiments are directed to a photonic device that includes a first substrate defining a surface and a trench forming a depression along a portion of the surface, and a second substrate coupled with the surface and extending from the surface to form a raised portion around the trench. The photonic device can also include a laser die positioned within the trench, such that the laser die is surrounded by the second substrate, and an optical material positioned within a region between the laser die and the second substrate. The photonic device can further include a third substrate coupled with the second substrate such that the second substrate is positioned between the first substrate and the third substrate such that the second substrate is configured to at least partially isolate the laser die from mechanical stress exerted on the optical device.

公开(公告)号：US11525967B1

公开(公告)日：2022-12-13

申请号：US16582838

申请日：2019-09-25

Applicant: Apple Inc.

Inventor： Alfredo Bismuto ,  Mark Arbore ,  Jason Pelc ,  Hooman Abediasl ,  Andrea Trita

IPC: G02B6/42 ,  G02B6/02 ,  G02B6/00 ,  G02B6/293

Abstract: This disclosure relates to the layout of optical components included in a photonics integrated circuit (PIC) and the routing of optical traces between the optical components. The optical components can include light sources, a detector array, and a combiner. The optical components can be located in different regions of a substrate of the PIC, where the regions may include one or more types of active optical components, but also may exclude other types of active optical components. The optical traces can include a first plurality of optical traces for routing signals between light sources and a detector array, where the first plurality of optical traces can be located in an outer region of the substrate. The optical traces can also include a second plurality of optical traces for routing signals between the light sources and a combiner, where the second plurality of optical traces can be located in regions between banks of the light sources.