公开(公告)号：US20250137160A1

公开(公告)日：2025-05-01

申请号：US18900244

申请日：2024-09-27

Applicant: Apple Inc.

Inventor： Bin Ma ,  Christoph Werner ,  Tsung-Han Li ,  Chynna R. Lopes ,  Wenyan Xue ,  Ming-Hua Ding ,  Jinwei Wang ,  Bo Li ,  Qikai Duan ,  Judy Runge-Nussbaum ,  Masashige Tatebe

IPC: C25D11/24 ,  C25D11/26

Abstract: An enclosure for an electronic device includes a metal substrate, a porous anodic oxide layer overlaying the metal substrate, and a hydrothermal sealant disposed on the anodic oxide layer, the hydrothermal sealant including a molten salt.