公开(公告)号：US11716829B1

公开(公告)日：2023-08-01

申请号：US17165763

申请日：2021-02-02

Applicant: Apple Inc.

Inventor： Cheng P. Tan ,  Sivesh Selvakumar ,  Jesse T. Dybenko ,  Enoch Mylabathula ,  Jason C. Sauers ,  Phil M. Hobson ,  Laura M. Campo ,  Dragos Moroianu

IPC: H05K7/20

CPC classification number: H05K7/20136 ,  H05K7/2039

Abstract: A head-mountable device can provide a cooling module that effectively manages heat while also minimizing noise, vibration, leakage, power consumption, size, and weight. To dissipate heat, the cooling module with a fan can be operated to move air through a chamber within the head-mountable device. An integrated heat sink can provide heat dissipation properties by drawing heat away from heat-generating components and into the chamber. The integrated heat sink can include a base plate that defines at least a portion of the chamber in which the blades of the fan are positioned. The integrated heat sink can further include fins between the chamber and an outlet. The fins can be integrated with the base plate to maximize heat dissipation and reduce the number of interfaces between separate parts.