公开(公告)号：US09577315B2

公开(公告)日：2017-02-21

申请号：US14306121

申请日：2014-06-16

Applicant: Apple Inc.

Inventor： Qingxiang Li ,  Robert W. Schlub ,  Fletcher R. Rothkopf ,  Adam D. Mittleman ,  Yi Jiang ,  Emily McMilin ,  Li-jun Zhang

IPC: H01Q1/24 ,  H01Q1/00 ,  H01Q1/42 ,  H01R12/00 ,  H01Q1/44 ,  H01Q1/22 ,  H01Q1/38 ,  H01Q1/48 ,  H01Q9/04 ,  H01Q9/42

CPC classification number: H01Q1/38 ,  H01Q1/2266 ,  H01Q1/24 ,  H01Q1/243 ,  H01Q1/44 ,  H01Q1/48 ,  H01Q9/0421 ,  H01Q9/42 ,  H01Q13/10

Abstract: Electronic devices are provided that contain wireless communications circuitry. The wireless communications circuitry may include radio-frequency transceiver circuitry and antenna structures. The antenna structures may include antennas such as inverted-F antennas that contain antenna resonating elements and antenna ground elements. Antenna resonating elements may be formed from patterned conductive traces on substrates such as flex circuit substrates. Antenna ground elements may be formed from conductive device structures such as metal housing walls. Support and biasing structures such as dielectric support members and layer of foam may be used to support and bias antenna resonating elements against planar device structures. The planar device structures against which the antenna resonating elements are biased may be planar dielectric members such as transparent layers of display cover glass or other planar structures. Adhesive may be interposed between the planar structures and the antenna resonating elements.

Abstract translation: 提供包含无线通信电路的电子设备。 无线通信电路可以包括射频收发器电路和天线结构。 天线结构可以包括天线，例如包含天线谐振元件和天线接地元件的倒F天线。 天线谐振元件可以由诸如柔性电路基板的基板上的图案化导电迹线形成。 天线接地元件可以由诸如金属外壳壁的导电器件结构形成。 诸如电介质支撑构件和泡沫层的支撑和偏置结构可用于支撑和偏置天线谐振元件抵抗平面装置结构。 天线谐振元件被偏压的平面器件结构可以是诸如显示器盖玻璃或其它平面结构的透明层的平面电介质构件。 粘合剂可以介于平面结构和天线谐振元件之间。

公开(公告)号：US20140292591A1

公开(公告)日：2014-10-02

申请号：US14306121

申请日：2014-06-16

Applicant: Apple Inc.

Inventor： Qingxiang Li ,  Robert W. Schlub ,  Fletcher R. Rothkopf ,  Adam D. Mittleman ,  Yi Jiang ,  Emily McMilin ,  Li-jun Zhang

IPC: H01Q1/24

CPC classification number: H01Q1/38 ,  H01Q1/2266 ,  H01Q1/24 ,  H01Q1/243 ,  H01Q1/44 ,  H01Q1/48 ,  H01Q9/0421 ,  H01Q9/42 ,  H01Q13/10

Abstract: Electronic devices are provided that contain wireless communications circuitry. The wireless communications circuitry may include radio-frequency transceiver circuitry and antenna structures. The antenna structures may include antennas such as inverted-F antennas that contain antenna resonating elements and antenna ground elements. Antenna resonating elements may be formed from patterned conductive traces on substrates such as flex circuit substrates. Antenna ground elements may be formed from conductive device structures such as metal housing walls. Support and biasing structures such as dielectric support members and layer of foam may be used to support and bias antenna resonating elements against planar device structures. The planar device structures against which the antenna resonating elements are biased may be planar dielectric members such as transparent layers of display cover glass or other planar structures. Adhesive may be interposed between the planar structures and the antenna resonating elements.

Abstract translation: 提供包含无线通信电路的电子设备。 无线通信电路可以包括射频收发器电路和天线结构。 天线结构可以包括天线，例如包含天线谐振元件和天线接地元件的倒F天线。 天线谐振元件可以由诸如柔性电路基板的基板上的图案化导电迹线形成。 天线接地元件可以由诸如金属外壳壁的导电器件结构形成。 诸如电介质支撑构件和泡沫层的支撑和偏置结构可用于支撑和偏置天线谐振元件抵抗平面装置结构。 天线谐振元件被偏压的平面器件结构可以是诸如显示器盖玻璃或其它平面结构的透明层的平面电介质构件。 粘合剂可以介于平面结构和天线谐振元件之间。

公开(公告)号：US20170149127A1

公开(公告)日：2017-05-25

申请号：US15424605

申请日：2017-02-03

Applicant: Apple Inc.

Inventor： Qingxiang Li ,  Robert W. Schlub ,  Fletcher R. Rothkopf ,  Adam D. Mittleman ,  Yi Jiang ,  Emily McMilin ,  Li-jun Zhang

IPC: H01Q1/38 ,  H01Q13/10 ,  H01Q1/48

CPC classification number: H01Q1/38 ,  H01Q1/2266 ,  H01Q1/24 ,  H01Q1/243 ,  H01Q1/44 ,  H01Q1/48 ,  H01Q9/0421 ,  H01Q9/42 ,  H01Q13/10

Abstract: Electronic devices are provided that contain wireless communications circuitry. The wireless communications circuitry may include radio-frequency transceiver circuitry and antenna structures. The antenna structures may include antennas such as inverted-F antennas that contain antenna resonating elements and antenna ground elements. Antenna resonating elements may be formed from patterned conductive traces on substrates such as flex circuit substrates. Antenna ground elements may be formed from conductive device structures such as metal housing walls. Support and biasing structures such as dielectric support members and layer of foam may be used to support and bias antenna resonating elements against planar device structures. The planar device structures against which the antenna resonating elements are biased may be planar dielectric members such as transparent layers of display cover glass or other planar structures. Adhesive may be interposed between the planar structures and the antenna resonating elements.