公开(公告)号：US20180153418A1

公开(公告)日：2018-06-07

申请号：US15578624

申请日：2016-06-16

Applicant: Apple Inc.

Inventor： Thomas J. SULLIVAN ,  Habib S. KARAKI ,  Richard C. KIMOTO ,  Richard H. KOCH ,  Tobias J. HARRISON-NOONAN ,  R. Keith MONTGOMERY

IPC: A61B5/022

CPC classification number: A61B5/02233 ,  A61B5/02225 ,  A61B5/0235 ,  A61B5/6824

Abstract: A low-profile blood pressure measurement system and methods of use are disclosed. The system includes an expandable member or structure that has a multi-compartment structure and/or is mounted on a rigid surface or structure. The system is incorporated into a portable multi-function device, or is configured to communicate with a portable multi-function device.

公开(公告)号：US20230392990A1

公开(公告)日：2023-12-07

申请号：US18325804

申请日：2023-05-30

Applicant: Apple Inc.

Inventor： Han BI ,  Habib S. KARAKI ,  Zachary GAUBERT ,  Jiandong YU

IPC: G01K1/20 ,  G01K1/02

CPC classification number: G01K1/20 ,  G01K1/026

Abstract: An internal heat-generating component noise correction technique can be used to improve accuracy of temperature sensing. In some examples, a method includes at an electronic device including a first temperature sensor and a first heat-generating component, measuring a first temperature using the first temperature sensor, and in accordance with a determination that one or more criteria are satisfied, compensating the first temperature based on a first estimate of heat generated by the first heat-generating component to generate a second temperature, and estimating a third temperature external to the electronic device using the second temperature.

公开(公告)号：US20230098236A1

公开(公告)日：2023-03-30

申请号：US17930041

申请日：2022-09-06

Applicant: Apple Inc.

Inventor： Wegene H. TADELE ,  Habib S. KARAKI ,  James C. CLEMENTS ,  Chin S. HAN ,  Craig C. D'SOUZA ,  Daniel W. LABOVE ,  Esther CHEN ,  Joseph R. LEE ,  Kuo Jen HUANG ,  Wanfeng HUANG ,  Fred Y. CHOU ,  Hongling CHENG ,  Ali M. AMIN ,  Chia-Hsien LIN

IPC: G01K17/20 ,  G01K7/02

Abstract: Robust estimation of temperatures inside and outside a device can be achieved using one or more absolute temperature sensors optionally in conjunction with thermopile heat flux sensors. Thermopile temperature sensing systems can measure a temperature gradient across two locations within the device, to estimate absolute temperature at locations that are impractical to measure using absolute temperature sensors. Using heat flux models associated with the device, the thermopile temperature sensing system can be used to estimate temperature associated with objects that contact an outer surface of the device, such as a user's skin temperature. Additionally, the thermopile temperature sensing system can be used to estimate ambient air temperature. Within a device, temperature measurements from the thermopile temperature sensors can be used to compensate sensor measurements, such as when the accuracy or reliability of a sensor varies with temperature.