公开(公告)号：US10754205B2

公开(公告)日：2020-08-25

申请号：US16041591

申请日：2018-07-20

Applicant: Apple Inc.

Inventor： Burak Metin ,  Logan M. Ames ,  HaiLong Wang ,  Ricky C. Lee ,  Duy P. Le

IPC: G02F1/1341 ,  G02F1/1339 ,  G06F1/16 ,  C09J5/00 ,  B29C45/14

Abstract: An electronic device is disclosed. The electronic device may include an enclosure that includes a metal band and a wall. The electronic device may further include a filler compound positioned in an opening of the metal band, where a split between two sidewall components defines the opening. The filler compound provides an RF communication path through the enclosure. In order to reduce or prevent liquid ingress into the enclosure, the electronic device may include a sealing compound that infused into the opening between the filler compound and the sidewall components, thereby providing a seal. The infusion process including placing the metal band (with the filler compound) in a chamber, providing a vacuum to remove air between the metal band and the filler compound, and subsequently providing a positive pressure to force the sealing compound between the metal band and the filler compound. The sealing compound may include an adhesive.