Vacuum impregnation seal in an electronic device

    公开(公告)号:US10754205B2

    公开(公告)日:2020-08-25

    申请号:US16041591

    申请日:2018-07-20

    申请人: Apple Inc.

    摘要: An electronic device is disclosed. The electronic device may include an enclosure that includes a metal band and a wall. The electronic device may further include a filler compound positioned in an opening of the metal band, where a split between two sidewall components defines the opening. The filler compound provides an RF communication path through the enclosure. In order to reduce or prevent liquid ingress into the enclosure, the electronic device may include a sealing compound that infused into the opening between the filler compound and the sidewall components, thereby providing a seal. The infusion process including placing the metal band (with the filler compound) in a chamber, providing a vacuum to remove air between the metal band and the filler compound, and subsequently providing a positive pressure to force the sealing compound between the metal band and the filler compound. The sealing compound may include an adhesive.

    STRUCTURAL SUPPORT MEMBER FOR A DATA PORT OF A DEVICE HOUSING

    公开(公告)号:US20200084306A1

    公开(公告)日:2020-03-12

    申请号:US16271665

    申请日:2019-02-08

    申请人: Apple Inc.

    IPC分类号: H04M1/02

    摘要: This disclosure describes features and methods of formation of a data port for a portable electronic device. The portable electronic device includes a device housing having a wall defining a data port opening. An anchoring feature is formed along a portion of the wall defining the data port opening. A structural support member is positioned within the data port opening and reinforces the data port opening. A polymer material fills a gap between the structural support member and a portion of the wall defining the data port opening. The polymer material engages the anchoring feature to retain the structural support member within the data port opening.