公开(公告)号：US11215193B2

公开(公告)日：2022-01-04

申请号：US16792034

申请日：2020-02-14

Applicant: Apple Inc.

Inventor： Halil Berberoglu ,  Cheng Ping Tan ,  Arash Naghib Lahouti ,  Richard A. Herms ,  Jesse T. Dybenko ,  Ashkan Rasouli

IPC: F04D29/42 ,  F04D17/10

Abstract: An electronic device with a fan assembly is disclosed. The fan assembly includes an impeller and an insert separated from the impeller by a gap. The fan assembly increases airflow by rotationally driving the impeller. For a sufficient rotational speed of the impeller, the airflow reaches a level that provides a force that displaces the insert. The displacement may include movement and/or compression of the insert. As a result of the displacement, the gap between the impeller and the insert increases. The increased gap reduces the pressure and associated noise that is otherwise caused by the airflow. When the rotational speed of the impeller reduces or ceases, the insert returns to its initial position. In this manner, the fan assembly includes a self-adjusting gap that changes based on the airflow.

公开(公告)号：US20240395660A1

公开(公告)日：2024-11-28

申请号：US18200365

申请日：2023-05-22

Applicant: Apple Inc.

Inventor： Halil Berberoglu ,  Cheng P. Tan ,  Jifang Tian ,  Chetan Harsha Edara ,  Pavan Kumar Varma Buddaraju ,  Scott J. Campbell

IPC: H01L23/427

Abstract: A thermal management module for an integrated circuit assembly includes a housing defining a configured to receive a fluid and having a variable cross-sectional area. The thermal management module also includes a wick disposed within the sealed passage, where the wick forms pores configured to convey a liquid form of the fluid toward an evaporator section of the thermal management module. The thermal management module also includes a void formed within the sealed passage between the wick and a wall of the housing, wherein the void is configured to convey a vapor form of the fluid toward a condenser section of the thermal management module.