公开(公告)号：US20240389269A1

公开(公告)日：2024-11-21

申请号：US18199851

申请日：2023-05-19

Applicant: Apple Inc.

Inventor： Anthony J. AIELLO ,  Chetan Harsha Edara ,  Pavan Kumar Varma Buddaraju

IPC: H05K7/20 ,  G06F1/20

Abstract: A thermal module includes parts with diverging or divergent walls that cause a capillary pressure gradient in a bonding paste used to secure the parts together. Based in part on the capillary pressure, the bonding paste is drawn in between the divergent walls, including small gaps between the walls. Additionally, during a reflow operation of the bonding paste, particles and/or air bubbles can egress from the bonding paste, allowing the bonding paste to freeze and form a homogeneous structure. By removing particles and air bubbles, the bonding paste can form a more robust structural joint and a hermetic seal for the thermal module. The multiple parts of the thermal module can be formed into their respective shapes prior to be joined together by the bonding paste. As a result, the formation of the thermal module is less likely to damage other structures, such as wick structures.

公开(公告)号：US20240395660A1

公开(公告)日：2024-11-28

申请号：US18200365

申请日：2023-05-22

Applicant: Apple Inc.

Inventor： Halil Berberoglu ,  Cheng P. Tan ,  Jifang Tian ,  Chetan Harsha Edara ,  Pavan Kumar Varma Buddaraju ,  Scott J. Campbell

IPC: H01L23/427

Abstract: A thermal management module for an integrated circuit assembly includes a housing defining a configured to receive a fluid and having a variable cross-sectional area. The thermal management module also includes a wick disposed within the sealed passage, where the wick forms pores configured to convey a liquid form of the fluid toward an evaporator section of the thermal management module. The thermal management module also includes a void formed within the sealed passage between the wick and a wall of the housing, wherein the void is configured to convey a vapor form of the fluid toward a condenser section of the thermal management module.