公开(公告)号：US20230251496A1

公开(公告)日：2023-08-10

申请号：US18134479

申请日：2023-04-13

Applicant: Apple Inc.

Inventor： Paul X. WANG ,  Yoonhoo JO ,  Trevor J. NESS ,  Samuel O. SCHNEIDER ,  Adam Y. KOLLGAARD ,  Scott M. LEINWEBER ,  Jeremy C. FRANKLIN ,  Heidi WILLIAMSON

IPC: G02B27/01

CPC classification number: G02B27/0176 ,  G02B2027/0156

Abstract: A head-mountable device can include modules that provide fit adjustment capabilities when assembled together. By providing head-mountable devices with modular features, certain modules can provide fit adjustment capabilities without requiring other modules to be custom designed or available in a wide variety of sizes and/or shapes. For example, a light seal module that provides engagement of a user's face and transmits light from a display element can be coupled to an HMD module. The coupling module that couples the light seal to the HMD module can be provided in a wide variety of sizes and/or shapes to allow a user to select an appropriate one for optimal alignment of an HMD module. Additionally or alternatively, a light seal module can be provided with manual and/or automated adjustment capabilities to achieve the desired fit.