公开(公告)号：US20230251496A1

公开(公告)日：2023-08-10

申请号：US18134479

申请日：2023-04-13

Applicant: Apple Inc.

Inventor： Paul X. WANG ,  Yoonhoo JO ,  Trevor J. NESS ,  Samuel O. SCHNEIDER ,  Adam Y. KOLLGAARD ,  Scott M. LEINWEBER ,  Jeremy C. FRANKLIN ,  Heidi WILLIAMSON

IPC: G02B27/01

CPC classification number: G02B27/0176 ,  G02B2027/0156

Abstract: A head-mountable device can include modules that provide fit adjustment capabilities when assembled together. By providing head-mountable devices with modular features, certain modules can provide fit adjustment capabilities without requiring other modules to be custom designed or available in a wide variety of sizes and/or shapes. For example, a light seal module that provides engagement of a user's face and transmits light from a display element can be coupled to an HMD module. The coupling module that couples the light seal to the HMD module can be provided in a wide variety of sizes and/or shapes to allow a user to select an appropriate one for optimal alignment of an HMD module. Additionally or alternatively, a light seal module can be provided with manual and/or automated adjustment capabilities to achieve the desired fit.

公开(公告)号：US20240230318A1

公开(公告)日：2024-07-11

申请号：US18559555

申请日：2022-05-10

Applicant: Apple Inc.

Inventor： PAUL X. WANG ,  Scott M. LEINWEBER ,  Adam Y. KOLLGAARD ,  Jeremy C. FRANKLIN

IPC: G01B11/24 ,  G02B27/32 ,  G06T7/60

CPC classification number: G01B11/24 ,  G02B27/32 ,  G06T7/60 ,  G06T2200/24 ,  G06T2207/30204

Abstract: A fitting device that can be worn by a user to facilitate detection of the user's features and guide the user to selecting components (e.g., modules) of a head-mountable device that will provide the best fit when assembled together. By providing head-mountable devices with modular features, certain modules can provide a custom fit without requiring the entire head-mountable device to be custom fitted to each user. An electronic device can be operated to guide a user to select the optimal components, such as a face seal and/or head engager for use with an HMD module.

公开(公告)号：US20240142783A1

公开(公告)日：2024-05-02

申请号：US18409696

申请日：2024-01-10

Applicant: Apple Inc.

Inventor： Paul X. WANG ,  Scott M. LEINWEBER ,  Adam Y. KOLLGAARD ,  Venkata Narayana Murthy ARELEKATTI ,  Sally R. ANNIS

IPC: G02B27/01

CPC classification number: G02B27/0176

Abstract: Systems of the present disclosure can provide a head-mountable device that distributes forces along the user's head. A head-mountable device can include head securement element with a support element to engage the head of the user. The support element can be coupled to the frame or light seal module of the head-mountable device. The support element can be attachable or deployable from the head-mountable device. A head-mountable device can also distribute forces with a support portion extending from a band.