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公开(公告)号:US11910552B2
公开(公告)日:2024-02-20
申请号:US16904501
申请日:2020-06-17
Applicant: Apple Inc.
Inventor: Manish Mittal , Brian S. Tryon , James A. Yurko , Jing Zhou , Matthew S. Rogers , Naoto Matsuyuki
CPC classification number: H05K5/04 , C08K3/08 , H05K5/0017 , H05K5/0086 , H05K5/0217 , C08K2003/0831
Abstract: An electronic device may have a housing. The device may include metal structures such as a metal member forming a portion of the housing, a portion of a strap, or other portions of the device. A gold-containing coating such as a layer of elemental gold or a gold alloy may cover the metal member to provide the metal member with a gold appearance or other desired appearance. To protect the metal member and the gold-containing coating, the metal member and gold-containing coating may be covered with a protective coating layer such as an organic protective layer. The organic protective layer may have a fluoropolymer layer with thiol coupling groups to promote adhesion to the gold-containing layer or may contain a polymer layer with silane and thiol coupling groups that serves as an adhesion promotion layer for an overlapping fluoropolymer layer with silane coupling groups.
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公开(公告)号:US20210400830A1
公开(公告)日:2021-12-23
申请号:US16904501
申请日:2020-06-17
Applicant: Apple Inc.
Inventor: Manish Mittal , Brian S. Tryon , James A. Yurko , Jing Zhou , Matthew S. Rogers , Naoto Matsuyuki
Abstract: An electronic device may have a housing. The device may include metal structures such as a metal member forming a portion of the housing, a portion of a strap, or other portions of the device. A gold-containing coating such as a layer of elemental gold or a gold alloy may cover the metal member to provide the metal member with a gold appearance or other desired appearance. To protect the metal member and the gold-containing coating, the metal member and gold-containing coating may be covered with a protective coating layer such as an organic protective layer. The organic protective layer may have a fluoropolymer layer with thiol coupling groups to promote adhesion to the gold-containing layer or may contain a polymer layer with silane and thiol coupling groups that serves as an adhesion promotion layer for an overlapping fluoropolymer layer with silane coupling groups.
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