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公开(公告)号:US20250020522A1
公开(公告)日:2025-01-16
申请号:US18628146
申请日:2024-04-05
Applicant: Apple Inc.
Inventor: John P Bergen , Vincenzo Costanza
Abstract: An electronic device may include a housing and an ambient temperature sensor in the housing. The ambient temperature sensor may include a temperature sensor, a heat flux sensor, and a heat source. The heat source may heat the heat flux sensor, and an ambient temperature may be determined based on measurements from the temperature sensor and the heat flux sensor. If additional temperature sensors and/or heat flux sensors are included in the ambient temperature sensor, the ambient temperature may be determined directly based on heat flux and temperature differences between the sensors. Alternatively, the heat flux sensor may measure a rise in heat flux, and control circuitry may fit a convection coefficient to the rise in the heat flux. The ambient temperature may then be determined based on the convection coefficient. Instead of heating the heat flux sensor, the heat flux sensor may be cooled to determine the ambient temperature.
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公开(公告)号:US20240085223A1
公开(公告)日:2024-03-14
申请号:US18321456
申请日:2023-05-22
Applicant: Apple Inc.
Inventor: Michael J Glickman , David MacNeil , John P Bergen
CPC classification number: G01D21/02 , G01J1/44 , G01K17/00 , G01P5/12 , G01J2001/4266
Abstract: An electronic device may include an environmental sensor. In particular, the sensor may include a layer of metal and be operable as an anemometer, a thermometer, a bolometer, and/or a heat flux sensor. To operate as an anemometer or thermometer, circuitry may heat the layer of metal and calculate an air speed based on a decay of the metal temperature. To operate as a bolometer, a first portion of the metal may have a first optical absorption/insulation (e.g., be insulated), while a second portion may have a second optical absorption/insulation (e.g., be uncoated). Differences in heating/cooling of the first and second portions may be used to measure solar radiation. To operate as a heat flux sensor, different metals may be used, and Seebeck voltages between the different metals may be measured. The metal may be deposited on the housing or may be incorporated into a mesh on the device.
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