公开(公告)号：US12003019B2

公开(公告)日：2024-06-04

申请号：US17447555

申请日：2021-09-13

Applicant: Apple Inc.

Inventor： Erik G. de Jong ,  Junlin Mu ,  Sameer Pandya ,  Patrick J. Crowley ,  Antonio F. Herrera ,  James G. Horiuchi ,  Sherry Tang ,  Mario Martinis

IPC: H01Q11/02 ,  H01M10/0525 ,  H01M10/42 ,  H01M50/247 ,  H01M50/284 ,  H01Q1/24 ,  H01Q1/27 ,  H01R12/77 ,  H01R12/82

CPC classification number: H01Q1/273 ,  H01M10/0525 ,  H01M10/425 ,  H01M50/247 ,  H01M50/284 ,  H01Q1/241 ,  H01R12/77 ,  H01R12/82 ,  H01M2220/30

Abstract: A portable or wearable electronic device can include a device housing defining an internal volume, and an electronic component disposed in the internal volume. The electronic component can be an input component and can have a component housing. The electronic device can also include an antenna feed assembly disposed in the internal volume. The antenna feed assembly can include a conductive grounding component electrically connected to the component housing and the device housing, and an antenna feed component electrically connected to the grounding component and disposed adjacent to the component housing. The conductive grounding component can surround a first major surface and a second major surface of the component housing.

公开(公告)号：US20220271419A1

公开(公告)日：2022-08-25

申请号：US17447555

申请日：2021-09-13

Applicant: Apple Inc.

Inventor： Erik G. de Jong ,  Junlin Mu ,  Sameer Pandya ,  Patrick J. Crowley ,  Antonio F. Herrera ,  James G. Horiuchi ,  Sherry Tang ,  Mario Martinis

IPC: H01Q1/27 ,  H01Q1/24 ,  H01R12/82 ,  H01R12/77 ,  H01M50/284 ,  H01M10/0525 ,  H01M10/42 ,  H01M50/247

Abstract: A portable or wearable electronic device can include a device housing defining an internal volume, and an electronic component disposed in the internal volume. The electronic component can be an input component and can have a component housing. The electronic device can also include an antenna feed assembly disposed in the internal volume. The antenna feed assembly can include a conductive grounding component electrically connected to the component housing and the device housing, and an antenna feed component electrically connected to the grounding component and disposed adjacent to the component housing. The conductive grounding component can surround a first major surface and a second major surface of the component housing.