公开(公告)号：US10419050B1

公开(公告)日：2019-09-17

申请号：US15991911

申请日：2018-05-29

申请人： Apple Inc.

发明人： Berke Cetinoneri ,  James Tsung-Tai Yang ,  William J. Noellert ,  Jyotirmoy Hore ,  Bradley David Scoles

IPC分类号： H03C1/52 ,  H04B1/18 ,  H03H7/38 ,  H03F3/195

摘要： An electronic device may include processing circuitry having a first impedance coupled to a first circuit board, where the electronic device uses the processing circuity to generate one or more radio frequency signals. The electronic device may also include power circuitry to amplify the one or more radio frequency signals, where the power circuitry is coupled to a second circuit board. An interposer may be disposed between the first circuit board and the second circuit board. The interposer may include a via structure having a characteristic impedance to match the first impedance and the second impedance, where the via structure may transmit the one or more radio frequency signals through the interposer between the processing circuitry and the power circuitry.