公开(公告)号：US11086069B2

公开(公告)日：2021-08-10

申请号：US16535736

申请日：2019-08-08

Applicant: Apple Inc.

Inventor： Paul X. Wang ,  Bart K. Andre ,  Bryan W. Posner ,  Daniele G. De Iuliis ,  Dinesh C. Mathew ,  Kamal H. Habboub ,  Sung-Ho Tan ,  Joshua A. Spechler

IPC: F21V8/00 ,  H01L25/13 ,  H05K5/04 ,  H05K7/20 ,  G06F1/20

Abstract: An electronic device may have electrical components mounted in an interior region of the electronic device. A housing may surround the interior region and may separate the interior region from an exterior region that surrounds the electronic device. Arrays of recesses may be formed on opposing inner and outer sides of the housing. The arrays may be laterally offset from each other along the housing. The recesses on the inner and outer sides of the housing may meet at passageways within the housing. During operation of the electronic device, air may flow through the inner recesses, the passageways, and the outer recesses to cool electrical components within the interior region. Lighting may be provided for the housing. Light-emitting devices such as light-emitting diodes may be received within cavities in the housing. Light guiding structures, diffusers, reflectors, and other structures may be used to help adjust illumination from the light-emitting devices.

公开(公告)号：US20200081178A1

公开(公告)日：2020-03-12

申请号：US16535736

申请日：2019-08-08

Applicant: Apple Inc.

Inventor： Paul X. Wang ,  Bart K. Andre ,  Bryan W. Posner ,  Daniele G. De Iuliis ,  Dinesh C. Mathew ,  Kamal H. Habboub ,  Sung-Ho Tan ,  Joshua A. Spechler

IPC: F21V8/00 ,  H01L25/13 ,  H05K7/20 ,  H05K5/04

Abstract: An electronic device may have electrical components mounted in an interior region of the electronic device. A housing may surround the interior region and may separate the interior region from an exterior region that surrounds the electronic device. Arrays of recesses may be formed on opposing inner and outer sides of the housing. The arrays may be laterally offset from each other along the housing. The recesses on the inner and outer sides of the housing may meet at passageways within the housing. During operation of the electronic device, air may flow through the inner recesses, the passageways, and the outer recesses to cool electrical components within the interior region. Lighting may be provided for the housing. Light-emitting devices such as light-emitting diodes may be received within cavities in the housing. Light guiding structures, diffusers, reflectors, and other structures may be used to help adjust illumination from the light-emitting devices.