公开(公告)号：US20240229288A1

公开(公告)日：2024-07-11

申请号：US18316530

申请日：2023-05-12

Applicant: Apple Inc.

Inventor： James A. Curran ,  Kar-Wai Hon ,  Todd S. Mintz ,  Isabel Yang

IPC: C25D11/24 ,  C23C28/00 ,  C25D11/08 ,  C25D11/10 ,  H05K5/04

CPC classification number: C25D11/246 ,  C23C28/00 ,  C25D11/08 ,  C25D11/10 ,  H05K5/04

Abstract: An enclosure for an electronic device includes a titanium-aluminum clad substrate and an anodic oxide coating disposed on the titanium-aluminum clad substrate. The anodic oxide coating includes a density of between about 2.1 g/cm3 and about 2.4 g/cm3 or includes a maximum porosity between about 21% and about 31% and can be exposed to a temperature of over 150° C. without cracking or crazing.