公开(公告)号：US10345907B2

公开(公告)日：2019-07-09

申请号：US15814626

申请日：2017-11-16

Applicant: Apple Inc.

Inventor： Arman Hajati ,  Kayo Yanagisawa

IPC: H01F7/16 ,  H02N2/02 ,  H01F41/064 ,  G06F3/01

Abstract: A haptic actuator may include a housing, coils carried within the housing, and a field member moveable within the housing between the coils and including at least one permanent magnet. A controller may be coupled to the coils and configured to sense a respective back electromotive force (EMF) value of each of the coils and determine a position of the field member in dimensions based upon the back EMF values and motor constant values.

公开(公告)号：US11056441B2

公开(公告)日：2021-07-06

申请号：US16703911

申请日：2019-12-05

Applicant: Apple Inc.

Inventor： Colleen F. Mischke ,  Kayo Yanagisawa ,  Yazan Z. Alnahhas

IPC: H01L23/552 ,  H01L33/48 ,  H01L25/16 ,  H01L33/58

Abstract: An electronic module includes a circuit substrate including conductive pads interconnected by traces, including a ground pad for connection to an electrical ground. One or more electronic components are mounted on the circuit substrate. A housing including a dielectric material is mounted on the circuit substrate so as to cover the one or more electronic components. A metal lead, which has first and second ends, is embedded in the dielectric material such that the first end contacts the ground pad on the circuit substrate when the housing is mounted on the circuit substrate, and the second end is exposed at an outer surface of the dielectric material. A conductive coating is disposed over the outer surface of the housing in galvanic contact with the exposed second end of the metal lead.

公开(公告)号：US20210175180A1

公开(公告)日：2021-06-10

申请号：US16703911

申请日：2019-12-05

Applicant: Apple Inc.

Inventor： Colleen F. Mischke ,  Kayo Yanagisawa ,  Yazan Z. Alnahhas

IPC: H01L23/552 ,  H01L33/48 ,  H01L33/58 ,  H01L25/16

Abstract: An electronic module includes a circuit substrate including conductive pads interconnected by traces, including a ground pad for connection to an electrical ground. One or more electronic components are mounted on the circuit substrate. A housing including a dielectric material is mounted on the circuit substrate so as to cover the one or more electronic components. A metal lead, which has first and second ends, is embedded in the dielectric material such that the first end contacts the ground pad on the circuit substrate when the housing is mounted on the circuit substrate, and the second end is exposed at an outer surface of the dielectric material. A conductive coating is disposed over the outer surface of the housing in galvanic contact with the exposed second end of the metal lead.