公开(公告)号：US20240080970A1

公开(公告)日：2024-03-07

申请号：US18122339

申请日：2023-03-16

Applicant: Apple Inc.

Inventor： Leilei ZHANG ,  Abhay Maheshwari ,  Ali N. Ergun ,  Arun Chawan

IPC: H05K1/02 ,  H01L23/31 ,  H01L25/16 ,  H05K1/18 ,  H05K3/28

CPC classification number: H05K1/028 ,  H01L23/3135 ,  H01L25/162 ,  H05K1/189 ,  H05K3/284 ,  H01L25/0655

Abstract: Various embodiments of a flexible circuit package with a high-modulus molding compound layer are disclosed. A flexible circuit package includes a substrate with first and second regions. The first region is configured to bend. The flexible circuit package further includes a conductive line disposed on the second region, an electronic component disposed on the conductive line, and a molding compound layer disposed on the second region and surrounding the electronic component. A modulus of the molding compound layer is greater than a modulus of the substrate and the molding compound layer is configured to prevent the second region from bending.

公开(公告)号：US20230099638A1

公开(公告)日：2023-03-30

申请号：US17930053

申请日：2022-09-06

Applicant: Apple Inc.

Inventor： James C. CLEMENTS ,  Lan Hoang HOANG ,  Leilei ZHANG ,  Jacky G. KO ,  Jafir A. HAIDRI ,  Xinsheng CHU ,  Saahil MEHRA

IPC: G01K1/143 ,  G01K7/04 ,  G01K13/20

Abstract: Robust estimation of temperatures inside and outside a device can be achieved using one or more absolute temperature sensors optionally in conjunction with thermopile heat flux sensors. Thermopile temperature sensing systems can measure a temperature gradient across two locations within the device, to estimate absolute temperature at locations that are impractical to measure using absolute temperature sensors. Using heat flux models associated with the device, the thermopile temperature sensing system can be used to estimate temperature associated with objects that contact an outer surface of the device, such as a user's skin temperature. Additionally, the thermopile temperature sensing system can be used to estimate ambient air temperature. Within a device, temperature measurements from the thermopile temperature sensors can be used to compensate sensor measurements, such as when the accuracy or reliability of a sensor varies with temperature.