公开(公告)号：US20250105228A1

公开(公告)日：2025-03-27

申请号：US18475054

申请日：2023-09-26

Applicant: Apple Inc.

Inventor： Kyusang Kim ,  David M Kindlon ,  Kishore N Renjan ,  Manoj Vadeentavida ,  Bilal Mohamed Ibrahim Kani ,  Benjamin J Grena ,  Ali N Ergun ,  Jerzy S Guterman ,  Jee Tung Tan ,  Steven Webster ,  Parin R Dedhia ,  Howell John Chua Toc ,  Mandar S Painaik ,  Abhay Maheshwari ,  Wyeman Chen ,  Yanfeng Chen ,  Andrew N Leopold ,  Jun Zhang ,  Dhruv Gaba

IPC: H01L25/16

Abstract: Packages and methods of assembly are described in which barriers are utilized during overmolding to improve volumetric efficiency. In one embodiment, a barrier includes multiple variable height components located on an interior of the barrier, where the barrier prevents the variable height components from being overmolded during the encapsulation process. In one embodiment, a barrier includes a camera module mounted on an image sensor located on an interior of the barrier, where the barrier prevents the camera module and image sensor from being overmolded during the encapsulation process. In an embodiment, a barrier is mounted on a secondary tier with the secondary tier mounted on a primary tier, where the barrier prevents multiple connector components located on an interior of the barrier from being overmolded during the encapsulation process.

公开(公告)号：US20240080970A1

公开(公告)日：2024-03-07

申请号：US18122339

申请日：2023-03-16

Applicant: Apple Inc.

Inventor： Leilei ZHANG ,  Abhay Maheshwari ,  Ali N. Ergun ,  Arun Chawan

IPC: H05K1/02 ,  H01L23/31 ,  H01L25/16 ,  H05K1/18 ,  H05K3/28

CPC classification number: H05K1/028 ,  H01L23/3135 ,  H01L25/162 ,  H05K1/189 ,  H05K3/284 ,  H01L25/0655

Abstract: Various embodiments of a flexible circuit package with a high-modulus molding compound layer are disclosed. A flexible circuit package includes a substrate with first and second regions. The first region is configured to bend. The flexible circuit package further includes a conductive line disposed on the second region, an electronic component disposed on the conductive line, and a molding compound layer disposed on the second region and surrounding the electronic component. A modulus of the molding compound layer is greater than a modulus of the substrate and the molding compound layer is configured to prevent the second region from bending.